Impinging-Jet Heat Sink for Compact 1U Server Cooling
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Solution Overview
Problem
Current liquid cooling technologies for electronic components in data centers face challenges with bulky, complex, and low-performance waterblocks that require large volume flow rates, making them unsuitable for compact 1U server modules due to space constraints and high energy consumption, and lack redundancy, leading to reliability issues.
Innovation Solution
A compact hydraulic flow delivery device with a plenum chamber and multiple jet orifices that direct high-velocity pressurized liquid flow onto a thermal surface, reducing flow rate requirements and enabling efficient heat transfer while maintaining a small form factor, allowing for integration into 1U server modules with redundant pumping solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling waterblocks are used, then cooling effectiveness is improved, but device size and complexity increase significantly
Solution Approach 1:
The cooling device is divided into distinct functional segments: a plenum chamber for fluid distribution, multiple jet orifices for targeted cooling, and an exit channel for heated fluid removal. This segmentation allows each component to be optimized independently while maintaining overall compactness and effectiveness.
Solution Approach 2:
The invention transitions from conventional two-dimensional fin-based heat dissipation to three-dimensional impinging jet flow patterns. Multiple jets impinge on the thermal surface from different positions, creating complex three-dimensional flow structures that enhance heat transfer efficiency within a compact volume.
2Temperature
If conventional waterblocks with high flow rates are used, then heat dissipation is improved, but energy consumption and pump size increase
Solution Approach 1:
The invention changes the flow regime parameters from high-flow-rate conventional cooling to low-flow-rate impinging jet cooling. By optimizing jet velocity, pressure, and orifice geometry, the system achieves enhanced heat transfer coefficients at significantly reduced flow rates, lowering pump power requirements and energy consumption.
3Volume of moving object
If compact waterblocks are designed for 1U server modules, then space utilization is improved, but cooling performance may be compromised
Solution Approach 1:
The invention utilizes hydraulic principles of impinging jet flow to maximize heat transfer within the constrained 1U form factor. High-velocity liquid jets impinge directly on the thermal surface, creating intense localized cooling that achieves high heat dissipation density without requiring large device volume.
4Device complexity
If integrated pump designs are used, then device compactness is improved, but reliability decreases due to single point of failure
Solution Approach 1:
The cooling system is segmented into modular components: the compact hydraulic flow delivery device (waterblock) is separated from the pumping function. This allows the waterblock to be optimized for compactness and heat transfer, while the pump can be selected as a reliable standalone component, potentially with redundancy, thereby improving overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high thermal and hydraulic performance with a compact form factor, reducing the need for large pumps and energy consumption, and facilitates packaging options suitable for 1U server modules by utilizing low flow rates and impinging jets for effective heat dissipation.
Implementation Method 1
A plurality of jet orifices provides an exit for pressurised liquid to exit a plenum chamber and impinge on a thermal surface
Implementation Method 2
liquid-based heat exchanger which uses the flow of liquid to effect cooling
Implementation Method 3
efficient heat transfer while maintaining a small form factor
Data Source
Figure 1
Figure 2~4A
Figure 4B~5B
AI summary
A liquid cooled thermal heat sink is provided. A plurality of jet orifices provide an exit for pressurised liquid to exit a plenum chamber and impinge on a thermal surface whereby they effect a cooling of the thermal surface, the heated liquid being transferred through an exit channel to dissipate heat away from the thermal surface.