Implant Connector Enclosure With Angled Lead Passageway

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Implantable medical devices face challenges in miniaturization due to the design complexities of connector enclosure assemblies, particularly in managing excess medical lead length and maintaining electrical connectivity while keeping the device size small.

Innovation Solution

The implementation of a connector enclosure assembly with an angled lead passageway relative to the base plane, combined with advanced machining techniques like wire EDM and milling, allows for a compact design while ensuring secure electrical connectivity and isolation from external conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the device size is reduced for miniaturization, then the implantable medical device becomes smaller and less obtrusive, but the connector enclosure assembly design becomes more complex and difficult to manage

Engineering Contradiction:
Improvedevice sizeVSAvoidconnector enclosure assembly design
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent introduces an angled lead passageway that extends at an angle relative to the base plane of the connector enclosure assembly. This angular configuration allows the lead to exit the device at an optimized angle, reducing the need for excessive lead length and simplifying the management of excess lead within the implantation pocket, thereby resolving the complexity issue associated with miniaturization

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the device size is reduced, then the implantable medical device becomes smaller, but the pocket size required for implantation is reduced which complicates the management of excess lead length

Engineering Contradiction:
Improvedevice sizeVSAvoidexcess lead management
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

By configuring the lead passageway at an angle rather than perpendicular to the base, the patent optimizes the trajectory of the lead as it exits the device. This angular arrangement allows for more efficient routing of the lead within the reduced implantation pocket, improving ease of operation for excess lead management despite the smaller device and pocket dimensions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If advanced machining techniques like wire EDM and milling are used, then the connector enclosure assembly can be precisely manufactured with angled lead passageway, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveangled lead passageway precisionVSAvoidmachining process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent separates the manufacturing process into distinct stages: first forming the base structure of the connector enclosure assembly, then creating the angled lead passageway through precise wire EDM or milling operations. This segmentation allows each machining operation to be optimized independently, managing the overall manufacturing complexity while achieving the required precision for the angled passageway

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12179028B2Implantable medical device
Publication Date: 2024.12.31 MEDTRONIC INC
  • US12179028B2 patent drawing
  • US12179028B2 patent drawing
  • US12179028B2 patent drawing

AI summary

An implantable medical device includes an enclosure sleeve and a top cap. The enclosure sleeve comprises an enclosure wall with at least a portion of the enclosure wall comprising the grade 5 titanium and having a thickness between 0.007 inches and 0.009 inches. The enclosure sleeve includes an open top end and an open bottom end that is opposite the open top end. The top cap includes a feedthrough block, a first top cap end portion, and a second top cap end portion. The first top cap end portion is configured to couple to the open top end of the enclosure sleeve, and the second top cap end portion configured to be positioned within the enclosure sleeve.