Implant Embedded Conductor Track for Body-Fluid Protection

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Solution Overview

Problem

Existing implant technologies face challenges in establishing electrical contacts with regions outside the implant housing in a simple manner while protecting components from contact with body fluids.

Innovation Solution

The implant design features a substrate with an embedded conductor track that connects electronic circuits inside the housing to electronic components outside, eliminating the need for complex feedthroughs and providing protection against body fluids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a feedthrough is formed in the titanium housing to establish electrical contact outside the housing, then electrical contact is established, but the manufacturing process becomes complex

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidelectrical contact reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The conductor track is extracted from the housing structure and embedded directly into the substrate. This separates the electrical connection function from the housing feedthrough, allowing the conductor track to be integrated into the substrate manufacturing process rather than requiring separate feedthrough formation in the titanium housing.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate serves as an intermediary element between the electronic circuit and the external environment. The embedded conductor track in the substrate provides the electrical connection path, replacing the need for direct feedthroughs in the housing while maintaining electrical reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the conductor track is exposed to establish electrical contact outside the housing, then electrical contact is established, but the conductor track becomes vulnerable to contact with body fluids

Engineering Contradiction:
Improveprotection against body fluidsVSAvoidconductor track embedding complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductor track embedding process is merged with the substrate manufacturing process. The conductor track is embedded into the substrate during substrate formation, creating a protected electrical connection path that is integrated into the substrate structure rather than requiring separate embedding steps.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If feedthroughs are formed in both the housing and substrate to establish electrical contact, then electrical contact is established, but the manufacturing process becomes even more complex

Engineering Contradiction:
Improveelectrical contact establishmentVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrical connection function is extracted from the housing feedthrough and relocated to the substrate. The conductor track embedded in the substrate assumes the electrical connection role, eliminating the need for corresponding feedthroughs in both the housing and substrate.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12343539B2Implant comprising embedded conductor track and production method
Publication Date: 2025.07.01 DYCONEX PATENTE
  • US12343539B2 patent drawing
  • US12343539B2 patent drawing
  • US12343539B2 patent drawing

AI summary

The disclosure relates to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.