Hermetic Implant Package With Transparent Coil Window Sealing

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Solution Overview

Problem

Hermetically sealed enclosures for implantable medical devices face challenges in maintaining stable electrical coupling while withstanding environmental factors, particularly in connecting transparent and opaque portions without causing material stress or requiring high-temperature brazing.

Innovation Solution

A hermetically sealed package design that uses low-temperature compression bonding techniques to connect weld rings to the transparent portion of the housing, allowing for the integration of an inductive coil and power source, and optionally includes biocompatible materials for implantation, enabling remote charging via RF electromagnetic radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high-temperature brazing is used to connect opaque and transparent portions, then hermetic sealing is achieved, but material stress and structural integrity deteriorate

Engineering Contradiction:
Improvehermetic sealingVSAvoidstructural integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the temperature parameter from high-temperature brazing to low-temperature compression bonding (below the glass transition temperature of the transparent portion). This allows hermetic sealing to be achieved without subjecting the materials to temperatures that would cause thermal stress, warping, or degradation of the transparent portion and surrounding materials.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal field (brazing) with a mechanical field (compression bonding). Instead of using heat to create the hermetic seal, the invention applies mechanical compression force to bond the weld ring to the transparent and opaque portions, thereby avoiding thermal stress while achieving the same sealing function.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Stability of the object's composition

If traditional hermetic sealing methods are used, then enclosure stability is achieved, but electrical coupling stability deteriorates

Engineering Contradiction:
Improveenclosure stabilityVSAvoidelectrical coupling stability
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent introduces a separate weld ring component that is compression bonded to the transparent portion. This weld ring serves as an intermediate electrical connection element that maintains stable electrical coupling between the inductive coil and the external charging system, while the transparent portion itself remains structurally stable. The segmentation of the sealing function and electrical connection function into separate components allows both requirements to be satisfied simultaneously.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If transparent portion is used for electromagnetic transmission, then inductive charging capability is improved, but hermetic sealing becomes more difficult

Engineering Contradiction:
Improveinductive charging capabilityVSAvoidhermetic sealing
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent introduces a weld ring as an intermediary component that is compression bonded to the transparent portion. This weld ring acts as a mediator that facilitates hermetic sealing of the transparent portion without requiring high-temperature processes that would compromise the transparent material. The intermediary weld ring allows the transparent portion to maintain its electromagnetic transmission properties while achieving reliable hermetic sealing through low-temperature compression bonding.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a stable and stress-free electrical connection within the hermetically sealed package, enabling efficient inductive charging of implantable medical devices while maintaining biocompatibility and avoiding high-temperature bonding issues.

Implementation Method 1

At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring... compression bonding the weld ring includes heating the weld ring, disposing the weld ring over the outer surface of the transparent portion of the housing, and cooling the weld ring

Methodology Applied
Scientific EffectCompression bonding:

Implementation Method 2

compression bonding the weld ring includes heating the weld ring, disposing the weld ring over the outer surface of the transparent portion of the housing, and cooling the weld ring

Methodology Applied
Scientific EffectThermal expansion and contraction: Thermal Expansion

Implementation Method 3

an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source... an inductive charging system can be utilized to charge the power source via the inductive coil

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentEP3813931B1Sealed package
Publication Date: 2023.11.22 MEDTRONIC INC
  • EP3813931B1 patent drawingFigure 1~2
  • EP3813931B1 patent drawingFigure 3
  • EP3813931B1 patent drawingFigure 4~5

AI summary

Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.