Implantable Adjunct Film Attachment Without Heat Lamination

The patent replaces the thermal bonding process (heat lamination) with a mechanical bonding process (ultrasonic welding). This substitution eliminates the harmful thermal effects that create air pockets and compromise structural integrity, while still achieving reliable film layer attachment through mechanical means. The ultrasonic welding process joins the film layer to the implantable adjunct without melting or deforming the materials, preserving both structural integrity and attachment reliability.

The patent replaces the thermal bonding process with ultrasonic welding, which is a mechanical process that joins materials through high-frequency vibration and friction rather than heat. This eliminates the formation of air pockets that occurs during heat lamination, as the mechanical process does not melt or deform the cushion material. The film layer is attached reliably through the mechanical interlocking and friction heat generated during ultrasonic welding, without creating harmful air pockets within the cushion structure.

The patent replaces heat lamination with ultrasonic welding to attach the film layer. This mechanical process does not involve melting or thermal deformation, thereby preserving the original thickness dimensions of the implantable adjunct. The film layer is bonded through mechanical friction and vibration-induced bonding, which does not cause the thickness variations that occur during heat lamination. This maintains manufacturing precision and ensures consistent thickness throughout the implantable adjunct.