Implantable Device Backfill Channel for Weld Debris Protection
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Solution Overview
Problem
Conventional implantable medical devices face challenges such as the risk of metallic projections from welding damaging internal components, high manufacturing costs due to manual and time-consuming epoxy casting processes, and assembly complexity, particularly with the need for weld protection bands and hermetic sealing.
Innovation Solution
Integrating a backfill feature with a backfilling channel and welding protection channel into the feedthrough or enclosure of the device, allowing for parallel header assembly and reducing the need for separate weld protection components, thus simplifying the manufacturing process and enhancing weld quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metallic strip or band is welded or machined to the back of the small hole to protect inner components from metallic projections, then the risk of component damage is reduced, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines the backfilling hole and welding protection function into a single integrated feature. The backfilling hole includes a welding protection channel that is fluidly coupled to the backfilling channel, eliminating the need for separate metallic strips or bands. This integration reduces the number of components and welding steps while maintaining protection of inner components from metallic projections during the laser seal welding process.
2Ease of manufacture
If the epoxy casting process is performed manually and time-consuming, then manufacturing flexibility is maintained, but productivity decreases and manufacturing time increases
Solution Approach 1:
The patent segments the manufacturing process into distinct modules: the header assembly with lead cavities and antennas can be manufactured separately through epoxy casting, then assembled to the hermetic enclosure assembly. This segmentation allows the epoxy casting to be performed as a standalone process that can be optimized for automation, improving productivity while maintaining manufacturing flexibility. The separated header assembly can be produced in parallel with other device components.
3Reliability
If a titanium band or strip is used to protect inner components, then metallic projection damage is prevented, but the band can be deformed during manufacturing stages and become unable to adequately protect components
Solution Approach 1:
The patent merges the protection function into the backfilling hole structure itself by incorporating a welding protection channel. This integrated design eliminates the separate titanium band or strip that can deform during manufacturing. The welding protection channel is formed as part of the backfilling hole structure, ensuring it maintains its protective function throughout the manufacturing process and provides reliable protection against metallic projections without the risk of deformation.
4Reliability
If the hole is laser seal welded to close the backfilling opening, then hermetic sealing is achieved, but liquid metallic projections can migrate through and down the hole damaging internal components
Solution Approach 1:
The patent introduces a welding protection channel as an intermediary structure between the backfilling hole and the inner components. This channel acts as a mediator that intercepts and contains metallic projections generated during laser seal welding, preventing them from reaching and damaging the internal electronic components while maintaining the hermetic seal integrity of the backfilling hole.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly time and costs, improves weld quality, and allows for more efficient use of resources by enabling parallel header assembly and reducing the risk of component damage during welding.
Implementation Method 1
The backfilling channel is configured to be sealed with welding of the backfilling channel after fluid backfilling of the interior of the enclosure
Implementation Method 2
The backfilling channel and the welding protection channel fluidly couple the exterior of the implantable medical device and the interior of the enclosure to allow for fluid backfilling of the interior of the enclosure
Implementation Method 3
This process forms a pool of liquid metal, that then solidifies and closes the hole
Implementation Method 4
This process forms a pool of liquid metal, that then solidifies and closes the hole
Implementation Method 5
This process forms a pool of liquid metal, that then solidifies and closes the hole
Data Source
AI summary
In various examples, an implantable medical device includes an enclosure including an enclosure wall. A feedthrough is sealingly disposed within an opening of the enclosure wall. A backfill feature includes a backfilling channel open to an exterior of the implantable medical device. A welding protection channel is fluidly coupled to the backfilling channel and extends from the backfilling channel to an interior of the enclosure. The backfilling channel and the welding protection channel fluidly couple the exterior of the implantable medical device and the interior of the enclosure for fluid backfilling of the interior of the enclosure. The backfilling channel is configured to be sealed with welding of the backfilling channel after fluid backfilling of the interior of the enclosure. The welding protection channel is configured to catch metallic projections from the welding of the backfilling channel to inhibit the metallic projections from entering the interior of the enclosure.