High-Density Implantable Electrical Connector with Arrayed Bond Pads
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Solution Overview
Problem
Current implantable electrical connector systems are limited in electrical connection density, making them unsuitable for next-generation neural interface devices that require hundreds or thousands of independent channels, as they are bulky and cannot accommodate the necessary high density of connections.
Innovation Solution
A high-density electrical connector system comprising first and second connector components with substrates, electrical feedthroughs, and conductive bond pads, along with an electrical coupling subsystem and fasteners to achieve a large number of independent electrical connections within a small area, using bio-compatible materials and configurations like coil springs or interconnect sheets for efficient contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional implantable electrical connector systems are used, then the connection structure is simple and easy to manufacture, but the electrical connection density is low and the device size is large
Solution Approach 1:
The connector system is divided into multiple independent contact elements arranged in arrays on both the male and female connectors. Each contact element can be independently configured, allowing high-density connections while maintaining a compact overall structure. The segmentation of contacts into discrete elements enables precise positioning and optimized space utilization.
Solution Approach 2:
The patent transitions from traditional linear or circular contact arrangements to two-dimensional array configurations. Multiple rows and columns of contacts are arranged on the connector surfaces, dramatically increasing the number of possible connections within a limited area. This dimensional expansion allows hundreds of independent channels to be accommodated in a small footprint.
2Adaptability or versatility
If the number of channels is increased to hundreds or thousands, then the neural interface capability is improved, but the connector becomes bulky and impractical for implantation
Solution Approach 1:
The male and female connectors are designed with nested or interlocking geometries that allow one to fit within or alongside the other. The female connector may be positioned within a recess of the male connector, or the two may interdigitate, maximizing space efficiency. This nesting approach enables high channel capacity without proportionally increasing the overall connector volume.
Solution Approach 2:
The connector components utilize thin-film construction techniques, particularly in the substrate and insulation layers. Flexible printed circuit board (FPCB) technology or thin ceramic substrates are employed to create lightweight, compact connector bodies that can accommodate numerous traces and contacts without excessive bulk. This thin-film approach reduces the volume required for high-channel-count connectors.
3Quantity of substance
If contact density is increased, then the electrical connection capability is improved, but the manufacturing precision requirement increases
Solution Approach 1:
Alignment features such as positioning protrusions, registration holes, or keyed geometries are incorporated into the connector designs before final assembly. These pre-configured alignment elements guide the mating process and ensure precise registration of corresponding contacts, reducing the tolerance requirements for the overall manufacturing process. The alignment features are built in during substrate fabrication or component assembly.
Solution Approach 2:
Flexible interconnect layers or compliant contact elements serve as intermediaries that can accommodate minor misalignments between male and female connectors. These intermediary components provide mechanical compliance and electrical continuity even when perfect alignment is not achieved, effectively decoupling the manufacturing precision requirements from the contact density achievements.
Data Source
AI summary
A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.