Miniature Implantable Connector With Reconnectable High-Density Channels
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Solution Overview
Problem
Current implantable connector technology limits neural interfaces to low channel counts due to irreversible bonding methods, making it difficult to upgrade or replace devices without causing tissue damage, and existing high-channel-count connectors are bulky and lack re-connectability.
Innovation Solution
Development of a miniaturized implantable connector with high channel density and a reliable clamping mechanism that allows for disconnecting and reconnecting, using precision machining and micromachining to achieve accurate features, enabling high-channel-density interconnects between interface leads and headers while maintaining channel-to-channel isolation and low contact impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If irreversible bonding methods (soldering, conductive adhesives, thermal-compression bonding) are used to connect neural interfaces, then reliable electrical connections are achieved, but the ability to disconnect and reconnect is lost, requiring full explantation for upgrades or battery changes
Solution Approach 1:
The implant system is divided into separable components: a header permanently implanted in the body and a connector that can be attached or detached. This segmentation allows the electrical connection to be reliable when connected, yet reversible when needed, resolving the contradiction between connection reliability and re-connectability.
Solution Approach 2:
A connector serves as an intermediary component between the permanently implanted header and the interface lead. This mediator enables reliable electrical connection during operation while allowing disconnection for upgrades or battery changes without requiring full explantation, thus resolving the contradiction.
2Quantity of substance
If high channel counts (>32) are implemented using existing connector technology, then more neural interfaces can be supported, but the device size increases and re-connectability is lost
Solution Approach 1:
The connector transitions from a linear arrangement of channels to a three-dimensional structure with multiple layers and vertical stacking. This dimensional change allows high channel counts to be achieved within a compact volume, resolving the contradiction between channel quantity and device size.
Solution Approach 2:
Multiple conductive elements and isolation structures are nested within each other in a compact arrangement. The connector integrates multiple functional elements in a nested configuration, enabling high channel density without proportionally increasing device volume.
3Quantity of substance
If high channel density connectors are designed, then more channels can be integrated in limited space, but manufacturing precision and channel-to-channel isolation become more difficult to achieve
Solution Approach 1:
A flexible isolation gasket is used to provide channel-to-channel isolation in the high-density connector. The flexible film can conform to the precise geometric requirements of high-density arrangements while being manufacturable with appropriate precision, resolving the contradiction between channel density and manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of high-channel-count neural interfaces that can be integrated into tissue without disturbing surrounding neural tissue, allowing for upgrades and battery changes without explanting the entire system, improving the scalability and reliability of neural interfaces.
Implementation Method 1
an array of interconnect mechanisms to maintain reliable connections between opposing individual pads in the pad arrays; and a reliable clamping mechanism that can deliver and maintain enough constant force to achieve reliable channel-to-channel isolation and low contact impedance contact between opposing elements in the pad arrays
Data Source
AI summary
Embodiments are provided that enable an implantable connector, along with related apparatuses, devices, systems, methods, computing devices, computing entities, and/or the like to serve patients with neural interfaces requiring connectors with higher channel densities (>0.05 ch/mm3) or higher channel counts (>32) than is practical with conventional implant-connector technology.