Implantable Electrical Contact with SiC Encapsulation
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Solution Overview
Problem
Implantable electrical connectors face degradation due to moisture ingress, leading to irreversible damage and reduced service life, as existing designs fail to effectively prevent water contact with electrical structures, particularly at interfaces between metallic and polymeric components.
Innovation Solution
An implantable electrical contact arrangement featuring a stack-shaped layer composite with a gold layer connected to an iridium layer via a diffusion barrier layer, encapsulated by a SiC layer, with a biocompatible, electrically insulating material surrounding the electrode body arrangement, including a platinum or titanium diffusion barrier to enhance cohesive bonding and prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallic electrode structures are used in implantable connectors, then electrical conductivity is achieved, but moisture penetration causes irreversible degradation and reduced service life
Solution Approach 1:
The patent employs a composite material structure consisting of multiple layers including a metallic electrode layer, a diffusion barrier layer, and an encapsulating polymer layer. This composite structure combines the electrical conductivity of metals with the moisture-blocking properties of polymers and diffusion barriers, thereby preventing moisture ingress while maintaining electrical functionality and extending service life
Solution Approach 2:
The patent introduces a diffusion barrier layer as an intermediary between the metallic electrode and the encapsulating polymer. This intermediate layer prevents direct contact between moisture and the metal, blocking diffusion pathways and eliminating the harmful interaction that causes degradation
2Reliability
If metallic electrode structures are exposed to moisture, then electrical functionality is maintained, but detachment between metallic and polymeric components occurs
Solution Approach 1:
The patent creates a composite structure where the metallic electrode, diffusion barrier, and polymer encapsulation work together as an integrated system. The diffusion barrier layer serves as a bonding interface that maintains strong adhesion between the metal and polymer while preventing moisture-induced detachment
Solution Approach 2:
The diffusion barrier layer acts as a mediator between the metallic and polymeric components, maintaining their bonding strength while preventing moisture from reaching the metal-polymer interface where detachment would occur
3Ease of manufacture
If conventional connector designs are used, then manufacturing simplicity is achieved, but moisture penetration at interfaces causes degradation
Solution Approach 1:
The patent integrates multiple functional layers (metallic electrode, diffusion barrier, polymer encapsulation) into a single composite structure that can be manufactured as one unit. This approach maintains manufacturing simplicity while providing superior moisture resistance compared to conventional multi-component assemblies
Solution Approach 2:
The patent employs a nested structure where the metallic electrode is embedded within the polymer matrix, and the diffusion barrier is positioned between them. This nested arrangement protects the metal from moisture while maintaining a compact, manufacturable design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the service life of implantable connectors by preventing moisture penetration and maintaining electrical functionality, with cohesive bonding forces of at least 70% between layers, and the use of iridium oxide for enhanced charge injection density and reduced impedance.
Implementation Method 1
a stack-shaped layer composite, which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer
Implementation Method 2
The stack-shaped layer composite is otherwise completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer directed away from the layer composite
Implementation Method 3
at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible, electrically insulating material
Data Source
AI summary
An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite by being completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer facing to be directed away from the layer composite. The SiC layer has an SiC layer surface which is facing to be directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.