Implantable Device Interconnection via Direct Contact Assembly
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Solution Overview
Problem
The fabrication of implantable medical devices is hindered by substantial interconnection efforts, materials, space, and costs due to the need for complex electrical connections between electronic modules and periphery components.
Innovation Solution
A method involving the initial alignment of component contacts and module contacts at a common distance, followed by a common motion to achieve direct mechanical contact and fixation, reducing the need for intermediate connection means and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical interconnection methods (connection tapes, bands, or connectors) are used between periphery components and electronic module, then reliable electrical connection is achieved, but interconnection efforts, materials, space, and costs increase substantially
Solution Approach 1:
The patent merges the periphery components and electronic module into a single integrated component carrier, eliminating the need for separate connection tapes, bands, or connectors. The component contacts are directly formed on the component carrier in electrical contact with the electronic module, combining multiple functions (component mounting, electrical connection, and structural support) into one unified structure.
Solution Approach 2:
The patent extracts and eliminates the intermediate connection means (connection tapes, bands, connectors) from the interconnection system. By directly forming component contacts on the component carrier that are in electrical contact with the electronic module, the patent removes unnecessary intermediary elements, reducing material usage and simplifying the overall structure.
2Reliability
If conventional electrical interconnection methods are used, then electrical connectivity is ensured, but the number of interconnection processes and manufacturing steps increases
Solution Approach 1:
The patent combines the component mounting and electrical connection processes into a single integrated structure. The component contacts are directly formed on the component carrier during the same manufacturing process, eliminating the need for separate interconnection steps and reducing the total number of manufacturing processes required.
3Volume of stationary object
If periphery components are arranged within a common housing to minimize volume, then space efficiency is improved, but substantial interconnection efforts and materials are required
Solution Approach 1:
The patent merges the component carrier with the housing structure, creating an integrated assembly where the housing serves dual purposes: providing structural enclosure and serving as the component carrier for mounting periphery components and electronic modules. This eliminates the need for separate connection materials while maintaining compact volume.
Solution Approach 2:
The patent extracts and removes the interconnection materials (connection tapes, bands, connectors) from the assembly by directly forming component contacts on the housing/ component carrier, thereby reducing material consumption while maintaining the compact housing design.
4Productivity
If direct mechanical contact between component contacts and module contacts is achieved, then the number of interconnection processes is reduced, but precise alignment and positioning are required
Solution Approach 1:
The patent performs preliminary action by pre-forming the component contacts on the component carrier in precise positions that correspond to the module contacts. The component carrier is designed with predetermined contact locations, ensuring that when components are mounted, their contacts automatically align with the module contacts without requiring complex real-time adjustment mechanisms.
Data Source
AI summary
Method for fabricating an implantable medical device comprising:providing a housing, an electronic module and a plurality of periphery components,the electronic module comprises module contacts for inputting/outputting electric energy to/from the electronic module,each periphery component comprises component contacts for inputting/outputting electric energy to/from the periphery component;arranging the electronic module and the periphery components in a first configuration wherein each component contact of each periphery component is positioned at a same initial distance relative to a corresponding module contact;displacing the electronic module and the periphery components by the initial distance relative to each other into a second configuration in which all component contacts of each periphery component directly mechanically contact respective corresponding module contacts;fixing the electronic module and the periphery components in the second configuration;accommodating the electronic module and the plurality of periphery components in the housing.