Implantable Device Thermal Dissipation Module
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Solution Overview
Problem
Existing implantable medical devices face challenges in heat dissipation and shock resistance, as they often isolate electronics within a hermetic container, leading to inadequate heat dissipation and inability to withstand various types of shocks, which can cause deformations and damage.
Innovation Solution
An implantable medical device featuring a hermetic box with a heat dissipation and shock absorption module, comprising a first thermal paste layer on the electronic card, a high thermal conductivity metal layer, and a third thermal paste layer with a structured cavity design against the internal wall, enhancing both heat dissipation and shock absorption capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronics are isolated in a hermetic container, then protection from biohazards and damage is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The hermetic container is segmented into an inner hermetic container and an outer hermetic container, with a heat dissipation module positioned between them. This segmentation allows the electronics to remain protected in the inner container while the heat dissipation module transfers heat to the outer container, resolving the contradiction between protection and heat dissipation.
Solution Approach 2:
A heat dissipation module acts as an intermediary between the inner hermetic container and the outer hermetic container. This module includes a first face in contact with the inner container and a second face in contact with the outer container, facilitating heat transfer while maintaining the hermetic seal and protecting the electronics.
2Strength
If traditional shock absorption materials are used, then shock resistance is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation module uses a composite structure combining a rigid support framework (for shock resistance) with thermally conductive material (for heat dissipation). The rigid support framework provides mechanical strength to withstand shocks, while the thermally conductive material ensures effective heat transfer from the inner to the outer hermetic container.
3Ease of manufacture
If the device structure is simplified, then ease of manufacture is improved, but shock absorption capability deteriorates
Solution Approach 1:
The thermally conductive material in the heat dissipation module has a porous structure with cavities distributed throughout. This porous structure allows the material to compress and deform during shock events, absorbing mechanical energy while maintaining thermal conductivity pathways for heat dissipation. The porous structure is achieved through conventional manufacturing methods such as injection molding, maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective heat dissipation and improved shock resistance by absorbing deformation energy, protecting internal electronics from damage and maintaining hermeticity, while being simple to manufacture using conventional materials.
Implementation Method 1
A first layer of thermal paste placed in the internal space of the case and deposited on said electronic card, A second metallic layer with high thermal conductivity deposited on said first layer, A third layer of thermal paste deposited on said second layer and arranged to come bearing against said internal wall of the casing
Implementation Method 2
A third layer of thermal paste deposited on said second layer and arranged to come bearing against said internal wall of the casing, said third layer comprising a structure having several cavities distributed over the entire contact zone of the third layer with the internal wall of the casing
Implementation Method 3
a heat dissipation and shock absorption module, housed in the internal space of the box and arranged between said electronic card and an internal wall of the case
Data Source
Figure 1~2D
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AI summary
The invention relates to an implantable medical device comprising: - A hermetically sealed housing (1), - At least one electronic board (2) housed in said housing, - A thermal dissipation and shock absorption module (4), housed in said housing and arranged between said electronic board (2) and an internal wall (10) of the housing, Said module comprising: - A first layer (40) of thermal paste placed in the internal space of the housing and deposited on said electronic board (2), - A second metallic layer (41) with high thermal conductivity deposited on said first layer (40), - A third layer (42) of thermal paste deposited on said second layer (41) and arranged to bear against said internal wall (10) of the housing, said third layer (42) comprising a structure having several cavities distributed over the entire contact area of the third layer with the internal wall of the housing.