Implantable Electrode Array With Integrated ASIC Packages
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Solution Overview
Problem
Existing implantable electrode arrays face challenges in manufacturing precision and cost due to the need for precisely dimensioned openings for control modules, which can increase production costs and complexity.
Innovation Solution
The electrode array design includes electrode ASIC packages with integrated circuits and electrodes on a substrate, a flexible frame for structural support, and a biocompatible insulating shell, eliminating the need for precise positioning of components and reducing stress on conductors, thus simplifying manufacturing and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If precisely dimensioned openings are provided for control modules in the carrier, then the control modules can be positioned accurately, but the manufacturing complexity and cost increase
Solution Approach 1:
The control modules are extracted from the carrier and integrated directly with the electrodes as separate electrode ASIC packages. Each package contains the electrode and its dedicated control module, eliminating the need for precisely dimensioned openings in the carrier for housing control modules.
Solution Approach 2:
The device is segmented into independent electrode ASIC packages, where each package is a self-contained unit with its own electrode and control module. This segmentation allows each package to be manufactured and tested independently, then assembled onto the carrier without requiring precise carrier openings.
2Manufacturing precision
If precisely dimensioned openings are provided for control modules, then component positioning is improved, but production costs increase
Solution Approach 1:
By dividing the device into separate electrode ASIC packages, each with its own electrode and control module, the manufacturing process becomes more straightforward. Each package can be produced using standard semiconductor packaging techniques, and the carrier needs only generic mounting features rather than precisely dimensioned openings, reducing overall production costs.
3Reliability
If control modules are positioned precisely in the carrier, then operational reliability is improved, but conductor stress increases
Solution Approach 1:
Each electrode ASIC package is a self-contained unit with the control module integrated directly with the electrode. This eliminates the need for long conductors running from a central control module to multiple electrodes, thereby reducing conductor length and minimizing stress on the conductors while maintaining reliable electrical connections.
Solution Approach 2:
The control module and electrode are merged into a single integrated electrode ASIC package. This integration eliminates the need for separate conductors between the control module and electrode, removing the source of conductor stress while ensuring reliable electrical connection within the compact package structure.
Data Source
AI summary
An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.