Implantable Electrode Contact Encapsulation Against Moisture Delamination
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Solution Overview
Problem
Implantable electrical contact arrangements face challenges in preventing moisture penetration, leading to degradation and reduced service life due to irreversible detachment between metallic structures in a moist environment.
Innovation Solution
A stack-shaped layer composite with a metallization layer on a ceramic substrate is bonded to a passivation layer, forming covalent bonds, and enclosed by biocompatible, electrically insulating material, preventing moisture ingress through covalent interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional metal vapor deposition processes are used to create electrical contact structures on ceramic substrates, then adhesive strength is improved, but protection against moisture penetration and delamination is insufficient
Solution Approach 1:
The patent applies a multi-layer composite structure consisting of a ceramic substrate, adhesion promoter layer, metallization layer, and polymer encapsulation material. This composite structure combines the advantages of each material: the ceramic substrate provides mechanical stability, the adhesion promoter ensures strong bonding, the metallization layer provides electrical conductivity, and the polymer encapsulation provides moisture barrier protection, thereby resolving the contradiction between adhesive strength and moisture resistance.
Solution Approach 2:
The patent uses a polymer encapsulation material in the form of thin films that completely surround the electrical contact arrangement. This flexible encapsulation layer acts as a barrier against moisture penetration while conforming to the underlying structures, effectively protecting the metallic components from the intracorporeal environment without compromising the adhesive strength of the underlying layers.
2Ease of operation
If metallic structures are exposed to the intracorporeal environment, then electrical contact functionality is maintained, but degradation and detachment occur due to moisture
Solution Approach 1:
The polymer encapsulation material forms a protective shell around the metallic structures, allowing electrical contact functionality to be maintained through the encapsulation interface while preventing moisture from reaching the metallic components. This extends the service life of the implantable electrical contact arrangement by protecting it from degradation and detachment in the intracorporeal environment.
Solution Approach 2:
The encapsulation material acts as an intermediary between the metallic electrical contact structures and the intracorporeal environment. It provides a interface that maintains electrical functionality while blocking moisture penetration, thereby resolving the contradiction between maintaining operational functionality and extending service life.
3Reliability
If complete encapsulation is implemented to prevent moisture ingress, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs conventional metal vapor deposition processes and screen printing techniques, which are well-established manufacturing methods. By using standard processes with optimized parameters (such as sputtered aluminum on tungsten-titanium adhesion layers), the patent achieves reliable moisture protection without significantly increasing manufacturing complexity. The polymer encapsulation is also applied using conventional techniques, maintaining manufacturing simplicity while ensuring complete protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves the resistance of the implantable contact arrangement to moisture, prolonging its intracorporeal operating duration by minimizing delamination and degradation.
Implementation Method 1
the stack-shaped layer composite of the electrode element arrangement is bonded to a passivation layer such that covalent bonds are formed
Data Source
AI summary
An implantable electrical contact arrangement has at least one electrode element arrangement enclosed entirely by biocompatible, electrically insulating material, and an electrode surface that is directly or indirectly enclosed by the biocompatible, electrically insulating material, the electrode element arrangement having a stack-shaped layer composite which has a metallization layer at least on a ceramic substrate over an adhesion promoter layer. The layer composite is bonded to a passivation layer such that covalent bonds are formed, and is otherwise completely encased by the passivation layer, except for at least one surface area of a metallization layer facing away from the layer composite. The passivation layer has a surface facing away from the layer composite and to which the biocompatible, electrically insulating material is directly or indirectly adjacent. The passivation layer is deposited on the layer composite by plasma-enhanced chemical vapor deposition, physical vapor deposition, or wet chemical coating.