Implantable Electrode Integration via Nested Nonconductive Well
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Solution Overview
Problem
Existing implantable medical devices (IMDs) face challenges in efficiently and cost-effectively integrating electrodes with nonconductive bodies to prevent conductive materials from coming into contact with the outer conductive surfaces, which can lead to interference and reduced functionality.
Innovation Solution
The method involves forming a nonconductive body with a well and conduit on the IMD, depositing conductive material into the well, and coupling it to the IMD's circuit through the conduit, using techniques like brazing, surface-grinding, and laser etching to ensure secure and flush integration of the conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive material is deposited on the outer surface of the IMD, then electrode functionality is achieved, but interference with other conductive surfaces and reduced device functionality occurs
Solution Approach 1:
The conductive material is nested within a cavity in the nonconductive body, which is itself integrated into the IMD housing. This nesting approach isolates the conductive electrode material from external conductive surfaces, preventing interference while maintaining electrode functionality for sensing and therapy delivery.
Solution Approach 2:
A nonconductive body acts as an intermediary between the conductive electrode material and the external environment. The nonconductive material prevents direct contact between the conductive electrode and other conductive surfaces, thereby eliminating interference while allowing the electrode to perform its electrical functions.
2Reliability
If conventional electrode integration methods are used, then electrode functionality is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The nonconductive body is merged with the IMD housing as an integrated component, eliminating the need for separate electrode mounting structures. The cavity for the conductive material is formed directly in the nonconductive body, simplifying the overall device architecture and reducing assembly steps.
Solution Approach 2:
The nonconductive body serves multiple functions: it provides structural support, electrically isolates the conductive electrode material, and integrates the electrode into the IMD housing. This multi-functionality reduces the number of separate components needed, thereby simplifying device complexity.
3Reliability
If conductive material is exposed on the surface, then electrode function is achieved, but contact with surrounding tissues causes interference
Solution Approach 1:
The conductive electrode material is nested within a cavity of the nonconductive body, which is integrated into the IMD housing. This nested structure ensures that the conductive material does not directly contact surrounding tissues, preventing interference while maintaining electrode function through the nonconductive barrier.
Solution Approach 2:
The nonconductive body acts as an intermediary barrier between the conductive electrode material and the patient's surrounding tissues. This intermediary prevents direct contact that would cause interference, while still allowing the electrode to perform its electrical sensing and therapy delivery functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the integration of electrodes within IMDs, reducing interference and improving the device's functionality while maintaining a smaller profile and cost-effectiveness.
Implementation Method 1
depositing conductive material into the well
Implementation Method 2
coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
Embodiments of the present disclosure relate to implantable medical devices. According to an exemplary embodiment, a method for forming an electrode on an implantable medical device (IMD), comprises forming a nonconductive body comprising a well having a bottom surface and at least one side surface extending from the bottom surface. The method further comprises forming a conduit through the bottom surface and inserting the nonconductive body into an opening in an external surface of the IMD. The method also comprises depositing conductive material into the well and coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well.