Implantable Feedthrough Connection Pin with Flattened Ends
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Solution Overview
Problem
Existing connection pins for implantable medical electronic devices often suffer from surface defects and microcracks due to cold forming, leading to issues with coating and solder flow, which affect the reliability of conductor connections.
Innovation Solution
A connection pin with a cylindrical pin body and flattened end sections featuring planar connecting surfaces, produced using ultrashort pulse laser treatment, which allows for optimal material bonding with band-shaped conductors and prevents solder flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If connection pins are cold formed to create a nail head, then the connection pin can be manufactured with standard processes, but the structure is changed and microcracks appear on the surface
Solution Approach 1:
The nail head is formed by swaging the wire before the final connection pin assembly is completed, preparing the structure in advance to avoid subsequent microcrack formation. This preliminary shaping action prevents the need for damaging cold forming operations later in the process.
Solution Approach 2:
The invention replaces the traditional cold forming mechanical process with a swaging process that uses controlled radial compression. This substitution eliminates the tensile stresses and microcracks associated with conventional cold forming while still achieving the desired nail head geometry for reliable connections.
2Shape
If the connection pin surface is cold formed, then the nail head shape is achieved, but coating quality is compromised and solder flow is affected
Solution Approach 1:
The swaging process replaces cold forming to create the nail head shape. This mechanical substitution produces a surface with superior integrity that is suitable for coating and soldering operations, eliminating the surface defects inherent in traditional cold forming methods.
Solution Approach 2:
The invention changes the manufacturing parameters from cold forming (high localized pressure with tensile components) to swaging (controlled radial compression). This parameter change achieves the same geometric outcome with vastly superior surface quality, enabling reliable coating adhesion and controlled solder flow.
3Ease of manufacture
If drawing grooves are present on the connection pin, then the pin can be formed from drawn wire, but solder flows undesirably along the connection pin
Solution Approach 1:
The invention extracts or removes the drawing grooves from the connection pin surface by using a swaging process instead of drawing. This elimination of harmful surface features prevents solder from adhering to and flowing along the pin, while still maintaining the ability to manufacture the pin from wire stock.
Solution Approach 2:
The invention converts the potential harm of surface irregularities by eliminating them through swaging. The smooth surface produced by swaging, which might seem to reduce manufacturing flexibility, actually benefits soldering by preventing unwanted solder flow and improving connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides increased design freedom, improved reliability, and long-term stability in conductor connections, reducing manufacturing defects and production costs while enhancing the geometric configuration of feedthroughs.
Implementation Method 1
applying an ultrashort pulse laser treatment to the wire material to form a pin body, at least one flattened end section, and at least one planar connecting surface
Data Source
AI summary
A connection pin of a feedthrough of an implantable medical electronic device has a primarily cylindrical pin body and at least one flattened end section. The flattened end section has at least one planar connecting surface formed on it, especially for connection by material bonding of a band-shaped conductor.