Implantable Feedthrough Layout for Dense Automated Wire Bonding
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Solution Overview
Problem
Existing implantable hermetic feedthrough devices face challenges in efficiently bonding a large number of wires in a small area while maintaining hermeticity, particularly in automated processes.
Innovation Solution
The design features a feedthrough member with a series of conductors arranged in a U-shaped pattern on a hexagonal grid, including both circular and triangular pads for alignment and orientation, facilitating automated bonding and providing additional auxiliary conductors for redundancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large number of wires are bonded in a small area, then the quantity of electrical connections is improved, but the ease of operation for automated bonding deteriorates
Solution Approach 1:
The conductor array is segmented into multiple groups arranged in a U-shaped pattern with an inner vacant portion. This segmentation allows bonding wires to be organized in groups, with the vacant inner portion providing access pathways for automated bonding tools to reach conductors that would otherwise be obscured by the sheer number of wires packed in a small area.
2Area of stationary object
If conductors are arranged in a dense pattern, then the area occupied is reduced, but the accessibility for bonding deteriorates
Solution Approach 1:
The conductor pattern uses an asymmetric U-shaped arrangement with a vacant inner portion rather than a symmetric circular or rectangular grid. This asymmetric design creates an accessible central region while maintaining high conductor density at the periphery, allowing automated bonding tools to access conductors without requiring a large overall area.
3Ease of operation
If the feedthrough design is optimized for automated bonding, then the ease of operation is improved, but the device complexity increases
Solution Approach 1:
Different regions of the feedthrough have different conductor densities and patterns. The peripheral regions contain dense conductor arrays for high connectivity, while the inner vacant portion provides access space. This local differentiation allows automated bonding to proceed easily without requiring the entire device to have low conductor density, thus managing overall complexity while maintaining ease of operation.
Data Source
AI summary
The present disclosure can provide an implantable feedthrough device including a feedthrough member formed of insulating material having opposing first and second surfaces. A series of conductors can extend through the feedthrough member between the first and second surfaces. The series of conductors can be arranged in a pattern that has an inner portion vacant of conductors for facilitating access for bonding wires to the conductors on at least one of the first and second surfaces of the feedthrough member.