Implantable Optical Sensor Modular Assembly
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Solution Overview
Problem
Current methods for manufacturing implantable optical sensors are costly, time-consuming, and lack ease of assembly, which hinders their widespread adoption in medical devices for monitoring physiological conditions.
Innovation Solution
The development of modular optical sensor assemblies with a hermetically sealed housing, using sapphire lenses and titanium ferrules, and a manufacturing process that includes a molded framework and printed circuit boards to simplify assembly and production, allowing for mass production of identical light-emitting and light-detecting components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing methods are used for implantable optical sensors, then manufacturing precision and reliability are maintained, but production costs increase and production time extends
Solution Approach 1:
The optical sensor is divided into modular components including a hermetically sealed housing, optical components (light source and detector), and electronic components that can be manufactured separately and assembled. This segmentation enables standardized mass production of identical components while simplifying the overall manufacturing process
Solution Approach 2:
The hermetically sealed housing serves multiple functions: it protects internal components from body fluid corrosion, provides structural support, and enables mass production through standardized manufacturing. This multi-functionality reduces the number of separate components needed, simplifying assembly while maintaining reliability
2Productivity
If traditional manufacturing methods are used for implantable optical sensors, then component quality is maintained, but production time and costs increase
Solution Approach 1:
Identical light-emitting and light-detecting components are pre-manufactured and standardized before final assembly. The hermetically sealed housing is pre-assembled with integrated seals and mounting features, allowing rapid final assembly without time-consuming customization or alignment procedures
Solution Approach 2:
Multiple functions are combined into single components to reduce assembly steps. The housing integrates structural support, hermetic sealing, and component mounting features. Electrical connections and optical alignments are integrated into the assembly process, reducing overall production time
3Ease of manufacture
If traditional manufacturing methods are used for implantable optical sensors, then reliability is maintained, but production costs and assembly complexity increase
Solution Approach 1:
A hermetically sealed housing with integrated seals is designed and manufactured beforehand to protect internal components from body fluid corrosion. This pre-engineered protection ensures reliability while simplifying assembly, as the sealed unit requires no additional sealing operations during final assembly
Solution Approach 2:
Identical light-emitting and light-detecting components are manufactured using standardized processes and designs. These replicated components ensure consistent performance and reliability while enabling mass production at lower costs through economies of scale
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time while enhancing the ease of assembly, leading to more efficient and reliable implantable optical sensors for monitoring physiological conditions, such as blood oxygen saturation and tissue perfusion.
Implementation Method 1
The sensor includes a hermetically sealed housing including a sapphire lens
Implementation Method 2
The sensor includes a hermetically sealed housing including a sapphire lens
Data Source
AI summary
An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.