Implantable Electronic Package Via Layout for Thinner IMDs
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Solution Overview
Problem
Current implantable medical devices (IMDs) face challenges in miniaturization, where the reduction in size and cost of components is hindered by the need for more compact and efficient electronic circuitry packaging.
Innovation Solution
The development of an electronic package with a conductive via disposed through an inactive region of a package substrate, separated from the active region by a portion of the inactive region, allows for reduced overall thickness and enables the formation of vias after integrated circuit placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimensions of IMDs are reduced to achieve miniaturization, then the size of the device is reduced, but the packaging complexity of electronic circuitry increases and manufacturing difficulty increases
Solution Approach 1:
The patent utilizes the vertical dimension by forming vias through the package substrate to connect integrated circuits on different surfaces. This three-dimensional interconnection approach allows compact packaging of electronic circuitry within the reduced IMD footprint, resolving the contradiction between miniaturization and packaging complexity.
Solution Approach 2:
The package substrate is prepared with predefined active and inactive regions before integrated circuit placement. This preliminary structuring of the substrate enables systematic organization of electronic components, simplifying the packaging process despite the reduced device size and preventing manufacturing complexity from increasing.
2Reliability
If vias are formed through the package substrate to connect integrated circuits, then the electrical connectivity is improved, but the manufacturing process complexity increases
Solution Approach 1:
The package substrate is divided into active regions (for integrated circuit placement) and inactive regions (for via formation). This segmentation allows vias to be formed in dedicated areas without interfering with circuit placement, improving electrical connectivity while managing manufacturing complexity through spatial separation of functions.
Solution Approach 2:
The package substrate acts as an intermediary structure that facilitates electrical connectivity between integrated circuits through controlled via formation. By using the substrate as a mediating element with predefined active and inactive regions, the patent achieves reliable electrical connections while maintaining ease of manufacture through a standardized process approach.
3Adaptability or versatility
If the active region is maximized for integrated circuit placement, then the functionality is improved, but the space for via formation is reduced
Solution Approach 1:
The package substrate exhibits local quality differentiation with distinct active regions optimized for integrated circuit placement and inactive regions optimized for via formation. This local specialization allows each region to perform its designated function effectively, maximizing both the functionality provided by integrated circuits and the space available for electrical interconnections without compromise.
Data Source
AI summary
Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.