Implantable Wireless Power Receiver Heat-Spreading Structure
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Solution Overview
Problem
Implantable medical devices experience significant temperature rises during wireless power transfer, exceeding safe limits due to heat generation from both external power transfer and internal electrical components, posing a risk of tissue damage.
Innovation Solution
Implementing thermal management systems within the implantable housing, including thermal layers and channels to dissipate heat, and utilizing thermal media to transport heat away from the central regions towards the edges, along with vapor rejection into the body's blood stream or other devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wireless power transfer is used to eliminate leads and improve patient comfort, then patient comfort and safety are improved, but thermal energy accumulation occurs in the implantable device
Solution Approach 1:
The implantable device is divided into multiple segments with different thermal properties. A first portion contains temperature-sensitive electronics while a second portion serves as a heat sink with higher heat capacity and thermal conductivity. This segmentation allows heat generated in the electronics to be conducted to the heat sink portion, preventing thermal accumulation in sensitive components while maintaining wireless power transfer benefits.
Solution Approach 2:
A thermal management system acts as an intermediary between the wireless power receiver and the temperature-sensitive electronics. This system includes heat conductive materials and heat sink structures that mediate heat transfer, conducting thermal energy away from sensitive components to safer regions of the device where it can be dissipated without harming the electronics or patient.
2Volume of moving object
If the implantable device is made smaller to improve patient comfort, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
Different regions of the compact implantable device are assigned different thermal qualities. The heat sink portion is designed with higher thermal conductivity and heat capacity materials, while the electronics portion is protected with thermal management structures. This local differentiation of thermal properties enables effective heat dissipation within the constrained small volume by concentrating heat management resources where most needed.
Solution Approach 2:
The thermal management structures are nested within the compact device architecture. Heat conductive materials and heat sink structures are integrated into the existing device geometry, with thermal pathways routed through available spaces. This nesting allows the thermal management system to be embedded within the small device volume without significantly increasing overall size, enabling heat dissipation in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces temperature rise to safe levels, minimizing tissue damage by distributing heat efficiently and maintaining device performance.
Implementation Method 1
at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver
Implementation Method 2
a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection
Implementation Method 3
a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver
Data Source
Figure 1~2
Figure 3A~3B
Figure 4A
AI summary
Thermal management solutions for wireless power transfer systems are provided, which may include any number of features. In one embodiment, an implantable wireless power receiver includes at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver. The thermal layer can comprise, for example, a copper layer or a ceramic layer embedded in an acrylic polymer matrix. In some embodiments, a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection. In yet another embodiment, a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver. Methods of use are also provided.