Implantable Wireless Power Receiver Thermal Layer for Heat Spreading
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Solution Overview
Problem
Implantable medical devices experience temperature rises during wireless power transfer, which can cause tissue damage, especially with higher power devices, as existing solutions either generate excessive heat or are not designed for implantable use.
Innovation Solution
A wireless power transfer system with an implantable housing featuring a thermal management layer comprising a material with different thermal conductivities for efficient heat dissipation, spreading heat across the layer to minimize temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If wireless power transfer is implemented in implantable medical devices, then power availability is improved, but temperature rise occurs causing tissue damage
Solution Approach 1:
A thermal management layer is introduced as an intermediary component between the electronics and the implantable housing. This layer mediates heat transfer by conducting heat away from hot spots while maintaining electrical isolation, thus enabling wireless power transfer without direct thermal contact to surrounding tissue
Solution Approach 2:
The thermal management layer utilizes materials with specific thermal conductivity parameters to control heat flow. By selecting materials with appropriate thermal conductivity values, the system optimizes heat dissipation pathways while maintaining safe operating temperatures during wireless power transfer
2Power
If higher power levels are used in implantable devices, then device functionality is improved, but temperature rise exceeds safe thresholds
Solution Approach 1:
The thermal management layer is divided into multiple segments or zones with different thermal conductivity characteristics. This segmentation allows different regions to handle heat differently - some areas conduct heat away rapidly while others provide thermal isolation, enabling effective thermal management at higher power levels
Solution Approach 2:
The thermal management layer employs composite material structures combining materials with different thermal properties. This composite approach enables simultaneous heat conduction in certain directions while providing thermal isolation in others, allowing the device to operate at higher power levels without exceeding temperature thresholds
3Temperature
If thermal management layer is added to implantable housing, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The thermal management layer is designed to perform multiple functions simultaneously: thermal conduction, electrical isolation, and mechanical support. By consolidating these functions into a single component, the overall device complexity is minimized while achieving effective thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces temperature rise in implantable medical devices, maintaining safe tissue temperatures by efficiently dissipating heat generated during power transfer, thus preventing damage.
Implementation Method 1
a single layer disposed between the implantable housing and the electronics, the single layer disposed on an interior surface of the implantable housing and comprising a thermal layer portion formed of a first material and a central portion formed of a second material, wherein a thermal conductivity of the thermal layer portion (108) and a thermal conductivity of the central portion (109) are different, the thermal layer portion and the central portion being positioned in the same plane, the single layer configured to dissipate heat generated by the electronics and spread the heat across the single layer
Implementation Method 2
Transferring power from an external device to an implanted device wirelessly with a Transcutaneous Energy Transfer (TET) system via, e.g., an oscillating magnetic field
Data Source
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Figure 3A~3B
Figure 4A
AI summary
Thermal management solutions for wireless power transfer systems are provided, which may include any number of features. In one embodiment, an implantable wireless power receiver includes at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver. The thermal layer can comprise, for example, a copper layer or a ceramic layer embedded in an acrylic polymer matrix. In some embodiments, a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection. In yet another embodiment, a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver.