Impregnation Composition for Electrical Windings
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Solution Overview
Problem
Existing impregnation materials for electrical windings face issues with homogeneity, leading to poor penetration and increased viscosity, which affects the thermal conductivity and insulation properties of electrical devices, especially in downsized motors.
Innovation Solution
A composition comprising 1-60 wt% of α, β-unsaturated polyester and/or polyester imide resin, combined with 0.1-80 wt% of an inorganic and/or organic-inorganic hybrid component, and 2-80 wt% of unsaturated monomeric and/or oligomeric components, forming a chemical network that enhances adhesion, thermal stability, and impregnation properties while maintaining low viscosity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic fillers are used to improve insulation properties and thermal conductivity, then electrical insulation and thermal transfer properties are improved, but homogeneity of the impregnation material deteriorates
Solution Approach 1:
The patent applies parameter changes by reducing the filler particle size to the nanometer range (0.1-10 μm, preferably 0.1-1 μm) and controlling the filler content within specific ranges (20-60 wt% of total resin composition). This parameter optimization maintains homogeneity while preserving the insulating and thermal properties of inorganic fillers.
Solution Approach 2:
The patent uses composite materials by combining organic resin components (polyester resin, epoxy resin, phenolic resin) with inorganic fillers (silica, alumina, titania) in a synergistic formulation. The composite structure allows the organic matrix to maintain homogeneity while the inorganic particles provide enhanced insulation and thermal conductivity.
2Reliability
If inorganic filler particles are used to improve insulation and thermal conductivity, then electrical insulation and thermal transfer properties are improved, but penetration into cavities of electrical windings deteriorates
Solution Approach 1:
The patent changes the particle size parameter to nanometer scale (0.1-10 μm), which allows the filler particles to penetrate into fine cavities and gaps of electrical windings effectively. The reduced particle size enables better flow characteristics and complete impregnation of complex winding structures.
Solution Approach 2:
The patent segments the inorganic filler into fine particles with specific size distribution (preferably 0.1-1 μm), allowing the impregnation material to penetrate into small cavities and gaps of electrical windings. This segmentation enables the material to access and fill micro-structures that larger particles cannot reach.
3Stability of the object's composition
If waterborne silica particles are used to improve homogeneity, then homogeneity is improved, but viscosity increases significantly
Solution Approach 1:
The patent changes the particle size parameter to nanometer range (0.1-10 μm, preferably 0.1-1 μm), which significantly reduces the viscosity increase caused by filler particles. The fine particle size allows for better dispersion and reduced inter-particle friction, maintaining low viscosity even with 20-60 wt% filler content.
Solution Approach 2:
The patent applies local quality by using different resin components (polyester resin, epoxy resin, phenolic resin) with specific functional groups that interact differently with the filler particles. This local chemical interaction improves dispersion and reduces aggregation, thereby controlling viscosity while maintaining homogeneity.
4Reliability
If high content of inorganic matter is used to improve thermal conductivity and insulation, then thermal transfer and electrical insulation are improved, but impregnation properties deteriorate
Solution Approach 1:
The patent changes the particle size parameter to nanometer scale (0.1-10 μm), which allows high inorganic content (20-60 wt%) to be incorporated while maintaining good impregnation properties. The fine particles reduce viscosity and improve flow characteristics, enabling complete penetration into electrical windings even at high filler concentrations.
Solution Approach 2:
The patent uses composite materials by combining multiple resin components (polyester, epoxy, phenolic resins) with inorganic fillers in optimized ratios. This composite formulation balances the viscosity-increasing effect of high inorganic content with the flow-enhancing properties of the organic matrix, maintaining impregnation capability while achieving high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent thermal transfer and electrical insulation with improved adhesion and thermal stability, ensuring effective impregnation even with high inorganic content, thereby enhancing the performance of electrical devices.
Implementation Method 1
component B) is a colloidal solution of an inorganic polymeric substance of at least one oxide of metals, metalloids or non-metals chemically bound to carbon, oxygen, nitrogen, sulphur and/or halogen atoms under forming polymers, carrying reactive groups which, upon curing of the impregnating resin composition, are able to chemically bind to the organic components A) and/or C)
Implementation Method 2
component B) is a colloidal solution of an inorganic polymeric substance
Implementation Method 3
the impregnation composition is the key component for that, Insulation properties and thermal conductivity can be improved using inorganic fillers
Implementation Method 4
The use of unsaturated polymers in compositions suitable for impregnating... wound items... for mechanical toughening and fixing
Data Source
AI summary
A composition for fixing wound items comprising A) 0 to 90 wt% of at least one a, ß-unsaturated polyester and/or polyester imide resin based on at least one unsaturated mono-, di- or tricarboxylic acids and/or mono-, di- or tricarboxylic acid group containing molecules, at least one polyol and/or, in case of an unsaturated polyester imide, at least one imide having 5-membered cyclic imide moieties, B) 0.1 to 80 wt% of at least one inorganic and/or organic-inorganic hybrid component having functionalities to react with component A) and C), C) 2 to 80 wt% of at least one monomeric and/or oligomeric unsaturated component to react with component A) and B), and D) 0 to 15 wt% of customary additives, the wt% being based on the total weight of the composition. The composition provides excellent thermal transfer properties and a high level of electrical insulation properties with excellent adhesion and thermal stability.