Imprint Apparatus Adjustment Using a Flat-Region Test Mold
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Solution Overview
Problem
The existing imprint techniques face challenges in adjusting imprint apparatuses without damaging expensive pattern molds, particularly due to strong pressing forces or particles between the substrate and the mold, which can lead to mold deterioration or defects in the pattern transfer.
Innovation Solution
An adjusting method using a test mold with a large flat region is employed, where the contact region includes a flat area without patterns, allowing for evaluation and adjustment of imprint conditions to prevent mold damage and defects, including the use of a test mold to evaluate and adjust the imprint apparatus based on the state of the contact region with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pattern mold is used for adjusting the imprint apparatus, then the imprint conditions can be evaluated, but the mold may be deteriorated or damaged due to strong pressing force or particles
Solution Approach 1:
The patent uses a test mold as a copy or substitute for the actual pattern mold. The test mold has the same structure including contact region, flat region, and release region, but without the expensive pattern. This allows evaluation of imprint conditions on substrates without risking damage to the valuable pattern mold, thus resolving the contradiction between evaluation accuracy and mold durability.
Solution Approach 2:
The test mold is designed as a disposable or low-cost component that can be replaced if damaged. Since it lacks the expensive pattern, even if it deteriorates during adjustment processes, the loss is minimal. This enables aggressive testing and adjustment without compromising the longevity of the actual pattern mold.
2Manufacturing precision
If strong pressing force is applied during imprinting for adjustment, then the imprint conditions can be properly evaluated, but the mold may be damaged
Solution Approach 1:
By using the test mold as a substitute, the patent enables application of strong pressing forces during adjustment without risking damage to the actual pattern mold. The test mold absorbs the mechanical stress, allowing thorough evaluation of imprint conditions including high-pressure scenarios.
Solution Approach 2:
The test mold serves as a protective buffer before the actual pattern mold is used. All preliminary adjustments, including those requiring strong pressing forces, are performed on the test mold first, cushioning against potential damage to the valuable pattern mold.
3Productivity
If particles are present between the substrate and the pattern mold, then the adjustment can proceed, but defects occur in the pattern transfer
Solution Approach 1:
The test mold provides a platform for evaluating particle contamination effects without using the actual pattern mold. Any defects caused by particles during adjustment are confined to the test mold usage, not affecting the quality of patterns transferred by the actual mold.
Solution Approach 2:
The patent converts the potential harm of particle contamination into a beneficial testing scenario. By deliberately allowing particles to be present during adjustment on the test mold, the system evaluates how particles affect imprinting while protecting the actual pattern mold from permanent damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of mold damage, lowers manufacturing costs, and effectively suppresses defects by allowing for precise adjustment of imprint conditions, thereby improving the throughput performance and quality of pattern transfer.
Implementation Method 1
shaping the imprint material is performed by making the mold in contact with the imprint material to fill the imprint material in a concave part configuring the pattern of the mold by a capillary phenomenon
Data Source
AI summary
An adjusting method for adjusting an imprint apparatus includes a preparation step of preparing a sample for evaluating a state in which a contact region of a test mold is in contact with an imprint material supplied on a substrate; an evaluation step of evaluating the sample; and an adjustment step of adjusting the imprint apparatus based on a result of evaluation obtained in the evaluation step. The contact region includes a flat region which does not include a pattern, the evaluation in the evaluation step includes a first evaluation, which is an evaluation of a state of the imprint material in the flat region, and the imprint apparatus is adjusted based on a result of the first evaluation in the adjustment step.