Imprint Apparatus Alignment via Contact State Feedback
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Solution Overview
Problem
In imprint apparatuses, achieving high accuracy alignment between a mold and a substrate is challenging due to positional shifts caused by frictional forces and external vibrations, which complicates pattern transfer and resin film thickness control.
Innovation Solution
An imprint apparatus with a stage that moves to align the mold and substrate using a detection unit to adjust the position based on detected shifts, employing a two-step movement process to correct for positional discrepancies and minimize deformation under frictional forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mold is pressed against resin on a substrate to transfer a pattern, then pattern transfer is achieved, but positional shift between mold and substrate occurs due to frictional forces and vibrations
Solution Approach 1:
The patent performs alignment of the mold and substrate in the contact state after the mold is pressed against the resin, rather than only before pressing. This preliminary alignment action in the contact state compensates for positional shifts that occur during pressing, ensuring accurate pattern transfer despite frictional forces and vibrations.
Solution Approach 2:
The patent uses a detection unit to detect the position of alignment marks on both the mold and substrate, and a processing unit to calculate the positional shift. This feedback mechanism continuously monitors and corrects the positional relationship between mold and substrate during the imprint process.
2Measurement precision
If alignment is performed before pressing the mold, then initial positioning is achieved, but positional shift occurs during pressing due to friction and vibration
Solution Approach 1:
The patent performs alignment in the contact state after pressing, serving as a preliminary correction action that accounts for positional shifts caused by frictional forces during pressing. This ensures that even though friction occurs, the final aligned position is accurate.
Solution Approach 2:
The detection unit detects alignment marks after pressing, and the processing unit calculates the actual positional shift that occurred during pressing. This feedback allows the system to compensate for the harmful effects of frictional forces by adjusting the stage position based on detected mark positions.
3Manufacturing precision
If resin film thickness is minimized to improve pattern transfer accuracy, then resolution is improved, but time to fill mold with resin and release force are affected
Solution Approach 1:
The patent changes the parameter of resin film thickness to a minimum value to improve pattern transfer accuracy and resolution. Despite this thin film, the alignment method in the contact state ensures accurate pattern transfer, while the cavity structure and soft member reduce release force requirements, maintaining productivity.
Solution Approach 2:
The patent introduces a cavity at the central portion of the mold back surface with different thickness than the peripheral portion, and provides a soft member on the mold holding unit. These localized structural modifications reduce the release force required while maintaining the thin resin film for high resolution.
4Speed
If mold and mold holding unit are made thin to reduce weight and improve responsiveness, then speed is improved, but deformation under external force increases
Solution Approach 1:
The patent creates a cavity at the central portion of the mold back surface, making the central region thinner than the peripheral region. This local quality variation reduces the overall weight and improves responsiveness while the thicker peripheral portion maintains structural strength to resist deformation under external forces.
Solution Approach 2:
The patent provides a soft member on the mold holding unit that can elastically deform to accommodate the thin mold structure. This dynamic element allows the thin mold to respond quickly to pressing motions while the soft member absorbs and distributes external forces, preventing excessive deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise alignment and reduced deformation, improving pattern transfer accuracy and resin film thickness control, thereby enhancing the quality and efficiency of the imprint process.
Implementation Method 1
an alignment mark formed on the substrate is optically detected to correct a shift in positional relationship between the mold and the substrate
Implementation Method 2
an ultraviolet-curing resin is irradiated with ultraviolet light while a transparent mold is kept in contact with the resin to cure the resin
Data Source
AI summary
The present invention provides an imprint apparatus which performs an imprint process in which a resin on a substrate is cured, in a contact state in which a mold is kept in contact with the resin, to transfer a pattern onto the substrate, the apparatus including a stage configured to move upon holding the substrate, a detection unit configured to detect a first mark formed on the mold, and a second mark formed on the substrate, and a processing unit configured to perform alignment of the mold and the substrate in the contact state.