Imprint Apparatus Alignment Error Correction
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Solution Overview
Problem
In semiconductor manufacturing, die-by-die alignment in imprint apparatuses faces challenges due to measurement errors in individual units, making it difficult to quantify and correct misalignment accurately, as these errors vary and are not constant across measurement units.
Innovation Solution
An imprint apparatus with internal measurement units that detect misalignment between a mold and a substrate, and external measurement marks, allows for the quantification and correction of measurement errors in each unit by calculating and applying specific correction values based on the tendency of measurement errors, ensuring accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple measurement units are used to measure misalignment amount, then measurement coverage is improved, but measurement precision deteriorates due to varying errors in each unit
Solution Approach 1:
The patent divides the measurement system into multiple independent measurement units, each responsible for specific measurement marks. By segmenting the measurement function across multiple units and individually characterizing their errors, the system achieves both wide coverage and high precision through distributed measurement with centralized correction
Solution Approach 2:
The patent changes the parameter of measurement error by introducing correction values for each measurement unit. Through external overlay measurement, the system determines individual error parameters for each measurement unit and applies corrective transformations, thereby transforming the measurement system from error-prone to high-precision
2Measurement precision
If individual measurement error correction is implemented, then alignment accuracy is improved, but device complexity increases due to multiple correction values
Solution Approach 1:
The patent implements a feedback mechanism where external overlay measurement results are used to determine correction values for each measurement unit. This feedback loop continuously characterizes measurement errors and applies appropriate corrections, enabling the system to maintain high precision without requiring complex hardware modifications
Solution Approach 2:
The patent introduces external measurement marks and overlay measurement as an intermediary system. This intermediary provides reference data that mediates between the internal measurement units and the final alignment result, allowing error correction without directly modifying the complex measurement unit architecture
Data Source
AI summary
An imprint apparatus that forms a pattern on a substrate using a mold and an imprint material comprises a plurality of measurement units configured to measure a misalignment amount between the mold and the substrate by detecting a plurality of internal measurement marks disposed on the mold and the substrate, an alignment unit configured to perform alignment of the mold and the substrate based on the misalignment amount measured by the plurality of measurement units, and a correction unit configured to respectively acquire a measurement error of each of the plurality of measurement units based on a deviation amount between external measurement marks provided on the mold and the substrate, and correct the alignment by the alignment unit based on the measurement error of each of the plurality of measurement units.