Imprint Alignment Marks for Precision Pattern Transfer
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Solution Overview
Problem
The imprint method for pattern formation faces challenges in achieving high accuracy alignment between the master and substrate, which is crucial for transferring fine patterns, as existing methods struggle to precisely measure and correct misalignments across the entire pattern region.
Innovation Solution
A pattern formation method and apparatus that utilize alignment marks at multiple corners and other locations on both the master and substrate, combined with a correction mechanism and control calculation unit, to calculate and adjust the relative position of the master and substrate, ensuring accurate alignment through precise movement and magnification correction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment marks are only placed at four corners of the shot region, then the alignment process is simple, but the measurement precision of misalignment across the entire pattern region is insufficient
Solution Approach 1:
The alignment mark configuration is segmented into two types: first alignment marks at the four corners of the shot region and second alignment marks at other locations within the shot region. This segmentation allows comprehensive coverage of the entire pattern region for misalignment measurement, improving measurement precision without creating a single complex configuration.
Solution Approach 2:
Different locations within the shot region are assigned different qualities by placing alignment marks at specific positions (corners and other locations). This local quality enhancement ensures that misalignment can be measured accurately at various regions, not just at the corners, thereby improving overall measurement precision.
2Manufacturing precision
If a single alignment measurement point is used, then the alignment process is fast, but the manufacturing precision of the transferred pattern is compromised
Solution Approach 1:
Alignment marks are pre-configured at multiple locations (four corners and other locations) before the alignment process begins. This preliminary action enables simultaneous or sequential measurement of misalignment at multiple points, improving pattern transfer precision without significantly increasing the time required, as the measurement infrastructure is already in place.
3Reliability
If alignment correction is performed only at four corners, then the alignment process is simple, but the reliability of alignment across the entire shot region is insufficient
Solution Approach 1:
The alignment correction mechanism is segmented to handle different types of alignment marks separately. First alignment marks at the corners and second alignment marks at other locations are measured and corrected through coordinated movements, ensuring reliable alignment across the entire shot region while maintaining a manageable correction mechanism structure.
Solution Approach 2:
The alignment system uses feedback from misalignment measurements at multiple locations (both corner and non-corner alignment marks) to calculate and execute appropriate correction movements. This feedback mechanism ensures high reliability of alignment across the entire shot region by continuously monitoring and adjusting based on actual misalignment conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-accuracy alignment and pattern transfer, minimizing misalignment across the entire pattern region, resulting in improved dimensional accuracy and precision of the transferred pattern.
Implementation Method 1
curing a photosensitive resin applied onto the substrate
Data Source
AI summary
According to one embodiment, a pattern formation method includes placing a master on a substrate including a concave-convex pattern, performing alignment between the master and the substrate, curing a photosensitive resin applied onto the substrate, with the pattern brought into contact with the resin, and removing the master from the resin. The performing alignment includes measuring amount of misalignment of first marks provided at least three of four corners of the shot region and performing alignment of the corners, after the alignment of the corners, measuring misalignment of a second mark, calculating a target value of amount of movement of the corners so as to minimize the amount of misalignment of the first marks and amount of misalignment of the second mark, and performing alignment between the master and the substrate so that the amount of movement of the corners is made close to the value.