Imprint Apparatus Parallel Alignment and Overlay Measurement
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Solution Overview
Problem
Conventional imprint apparatuses face challenges in efficiently determining the alignment status of individual shot regions during the imprinting process, particularly in the die-by-die scheme, where the lack of correlation between shot regions makes it impractical to inspect all regions for alignment, leading to increased time and cost in semiconductor mass production.
Innovation Solution
An imprint apparatus equipped with a measurement unit that performs parallel alignment and overlay measurements, using scopes to observe moire fringes formed by alignment and overlay marks on the mold and substrate, allowing for precise alignment and overlay confirmation between shot regions, thereby determining the alignment status of each shot region efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment measurement is performed for each shot region using the die-by-die scheme, then alignment precision is improved, but measurement time and inspection cost increase
Solution Approach 1:
The measurement process is segmented into two distinct functions: alignment measurement (comparing mold alignment marks with substrate shot region alignment marks) and overlay measurement (comparing alignment marks with pattern marks). This segmentation allows the system to perform measurements efficiently by dedicating specific detection mechanisms to each measurement type, thereby maintaining precision while reducing overall measurement time.
Solution Approach 2:
Alignment marks and pattern marks are pre-formed on the substrate before the imprinting process begins. The mold also has pre-formed alignment marks. This preliminary preparation of marks enables rapid measurement without requiring complex real-time calculations or additional measurement steps during the actual imprinting process.
2Manufacturing precision
If all shot regions are inspected for alignment status, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The system performs partial measurements by focusing on critical measurement points using the segmented measurement approach. Rather than conducting exhaustive inspections of every shot region with full measurement protocols, the system performs alignment measurement for all regions and overlay measurement selectively, achieving sufficient manufacturing precision while maintaining high productivity.
Solution Approach 2:
The patent replaces complex mechanical inspection systems with optical detection mechanisms. By using optical fields to detect alignment marks and pattern marks, the system achieves high measurement speed and precision simultaneously, eliminating the need for slow mechanical measurement devices that would bottleneck production throughput.
3Device complexity
If conventional alignment measurement methods are used, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
The detection mechanism is designed with multi-functionality, serving both alignment measurement and overlay measurement purposes. The same optical detection system detects both alignment marks and pattern marks, eliminating the need for separate complex measurement devices while maintaining high measurement precision for both functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient alignment and overlay measurement, reducing the need for extensive inspection and minimizing the time and cost associated with ensuring accurate alignment across all shot regions, thereby improving the throughput and efficiency of the imprinting process.
Implementation Method 1
scopes to observe moire fringes formed by alignment and overlay marks on the mold and substrate
Implementation Method 2
the resin is irradiated with ultraviolet rays to cure the resin
Data Source
AI summary
An imprint apparatus cures an imprint material, while a pattern formed on a mold is kept in contact with the imprint material, thereby transferring the pattern onto the imprint material. The apparatus includes a measurement unit which performs, in parallel, alignment measurement in which a relative position between the mold and a shot region on the substrate, to which the pattern is to be transferred, is measured so as to align the mold and the shot region, and overlay measurement in which a relative position between a first pattern already formed in another shot region on the substrate using the mold, and a second pattern underlying the first patter is measured.