Imprint Alignment Using Pattern Marks for Accurate Circuit Transfer
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Solution Overview
Problem
Existing imprint devices face challenges in accurately aligning circuit patterns on substrates due to deviations in the positional relationship between circuit patterns and alignment marks, which occur when these features are processed in different manufacturing steps, leading to misalignment during the imprinting process.
Innovation Solution
An imprint device that includes a measurement unit to optically detect alignment marks on both the mold and substrate, calculating relative positional deviations, and a control unit to correct alignment based on these measurements, ensuring precise alignment before curing the imprint material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alignment marks and circuit patterns are processed in different manufacturing steps, then manufacturing flexibility is improved, but positional accuracy between circuit pattern and alignment mark deteriorates
Solution Approach 1:
The patent introduces a pattern mark as an intermediary element that is formed together with the circuit pattern in the same manufacturing step. This pattern mark serves as a reference for calculating the relative positional deviation between the circuit pattern and alignment mark, enabling correction of positioning errors without compromising manufacturing flexibility
Solution Approach 2:
The patent implements a feedback mechanism where the relative positional deviation between the circuit pattern and alignment mark is measured using the pattern mark, and this deviation information is used to correct the alignment in subsequent imprinting processes. This closed-loop feedback ensures high positioning accuracy despite multi-step manufacturing
2Speed
If alignment is performed using alignment marks formed on the mold, then alignment speed is improved, but alignment accuracy deteriorates due to positional deviation between alignment mark and circuit pattern
Solution Approach 1:
The pattern mark acts as an intermediary reference that enables indirect measurement of the positional relationship between the circuit pattern and alignment mark. By measuring the positions of both marks relative to the pattern mark, the system calculates the relative deviation without requiring direct measurement between the circuit pattern and alignment mark, thus maintaining alignment speed while improving accuracy
Solution Approach 2:
The patent replaces direct mechanical alignment based on alignment marks with an optical measurement system that uses the pattern mark as a reference. This substitution allows for precise calculation of positional deviations through optical detection and computational correction, achieving both high speed and high accuracy
Data Source
AI summary
The present invention is to provide an imprint device that can form a circuit pattern with high accuracy even if a deviation occurs in a positional relationship between the circuit pattern and an alignment mark. The imprint device performs an imprinting process in which a mold on which a pattern is formed is brought in contact with an imprint material on a substrate and the pattern is transferred to the substrate at a target position on the substrate, and includes an alignment unit that performs alignment of the mold with the substrate such that the mold and the substrate are at an alignment position corrected based on an amount of relative positional deviation between a pattern mark formed near the pattern of the mold and an alignment mark of the mold obtained by measuring the pattern mark and the alignment mark, and a curing unit that cures the imprint material at the position at which alignment is performed by the alignment unit.