Imprint Apparatus Alignment Control for Peripheral Edge Precision
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Solution Overview
Problem
Existing imprint techniques face challenges in accurately forming imprint materials on semiconductor substrates, particularly in the peripheral edge portions, which affects the yield of semiconductor chips and the precision of pattern transfer due to difficulties in controlling the relative posture between the mold and the substrate during the imprint process.
Innovation Solution
An imprint apparatus equipped with a detector to detect alignment marks on the substrate and a controller to adjust the alignment based on these detections, allowing for precise alignment and pattern transfer across multiple transfer regions, including those with varying sizes, ensuring accurate formation of the imprint material even in the peripheral edge areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multi-area imprinting is performed on the central portion of the substrate, then productivity is improved, but manufacturing precision deteriorates in the peripheral edge portion
Solution Approach 1:
The patent applies local quality by making the alignment control strategy dependent on the specific shot region being processed. Different alignment reference strategies are used for central shot regions versus peripheral shot regions, optimizing precision for each location while maintaining overall productivity through multi-area imprinting.
Solution Approach 2:
The patent implements dynamic alignment control where the choice of alignment reference marks and the alignment procedure adapts based on the shot region characteristics. The system dynamically selects appropriate alignment references (marks in the same shot region versus marks in other regions) based on the specific geometric configuration and size of transfer regions in each shot region.
2Manufacturing precision
If alignment is performed using marks in all transfer regions, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by making the alignment control strategy dependent on the specific shot region being processed. Different alignment reference strategies are used for central shot regions versus peripheral shot regions, optimizing precision for each location while maintaining overall productivity through multi-area imprinting.
Solution Approach 2:
The patent implements partial action by selectively using alignment reference marks only from transfer regions that are appropriate for the current shot region. Instead of uniformly using all available marks across all regions, the system uses marks only from regions where they provide meaningful alignment reference, reducing unnecessary complexity while maintaining precision.
3Manufacturing precision
If the smallest transfer region is used for alignment reference, then manufacturing precision is improved, but the method becomes inapplicable when the smallest region lacks suitable marks
Solution Approach 1:
The patent implements universality by creating a flexible alignment reference selection system that can adapt to different shot region configurations. The method can universally handle various scenarios including shot regions with multiple transfer regions of different sizes, shot regions where the smallest region may or may not contain suitable alignment marks, and both central and peripheral shot regions on the substrate.
Solution Approach 2:
The patent implements dynamic alignment control where the choice of alignment reference marks and the alignment procedure adapts based on the shot region characteristics. The system dynamically selects appropriate alignment references (marks in the same shot region versus marks in other regions) based on the specific geometric configuration and size of transfer regions in each shot region.
Data Source
AI summary
The present invention provides an imprint apparatus that performs a process of forming an imprint material on a substrate using a mold, with respect to each of a plurality of shot regions on the substrate, the apparatus comprising: a detector configured to detect positions of marks provided in the substrate; and a controller configured to control, in the process, alignment between the substrate and the mold based on a detection result by the detector, wherein each of the plurality of shot regions includes two or more transfer regions where a pattern of an original has been individually transferred in a pre-process, and in the process on a specific shot region, the controller controls the alignment based on the detection result of the marks provided in the transfer region other than the smallest transfer region among the two or more transfer regions.