Imprint Alignment Sequencing Using Resin-Fill Detection Marks

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Solution Overview

Problem

The existing imprinting methods for semiconductor device manufacturing are inefficient due to the time-consuming alignment process between the template and the substrate, which requires waiting for resin to fill alignment marks, thereby reducing throughput.

Innovation Solution

An imprinting method and apparatus that utilize multiple alignment marks and imaging elements to detect resin filling levels, allowing for staged alignment operations based on detection signal thresholds, enabling earlier initiation of alignment and maintaining high accuracy by switching between different alignment marks as the resin fills them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the alignment process waits for resin to fill alignment marks, then alignment accuracy is improved, but processing time increases

Engineering Contradiction:
Improvealignment accuracyVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The imaging elements detect the filling state of alignment marks in advance during the resin filling process. The alignment determination unit can determine alignment completion as soon as the resin reaches a predetermined filling state, without waiting for complete filling. This preliminary detection and early decision-making enables the system to proceed with the next process step sooner, reducing overall processing time while maintaining alignment accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The imaging elements provide real-time feedback on the resin filling state of alignment marks. The alignment determination unit uses this feedback information to dynamically determine when alignment is sufficient, allowing the system to adapt the waiting time based on actual filling progress rather than using a fixed conservative wait time, thus optimizing the balance between accuracy and speed.

Inventive Principle:
Principle #23Feedback

2Productivity

If multiple alignment marks are used with staged alignment operations, then throughput is improved, but system complexity increases

Engineering Contradiction:
ImprovethroughputVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The alignment process is segmented into multiple independent operations, each handling a specific alignment mark. The imaging elements and alignment determination unit process each mark separately, detecting resin filling states independently. This segmentation allows parallel or sequential processing of different alignment marks without requiring complex inter-dependent control logic, managing system complexity while enabling staged alignment operations that improve throughput.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the throughput of the alignment process while maintaining high alignment accuracy by starting alignment operations earlier and completing them more quickly, reducing overall processing time.

Implementation Method 1

imaging elements to detect a first alignment mark included in the template and generate a first detection signal of the first alignment mark, a second imaging element positioned to detect a second alignment mark included in the template

Methodology Applied
Scientific EffectOptical detection: Absorption (EM radiation)

Data Source

PatentUS11899360B2Imprinting method and imprinting apparatus
Publication Date: 2024.02.13 KIOXIA CORP
  • US11899360B2 patent drawing
  • US11899360B2 patent drawing
  • US11899360B2 patent drawing

AI summary

An imprinting method includes placing a template onto non-solidified resin that is applied onto a surface of a substrate, such that the non-solidified resin extends into a pattern of the template in a surface direction of the substrate, starting first alignment operation to align the template with the substrate using a first alignment mark at a first timing, and starting a second alignment operation to align the template with the substrate using a second alignment mark at a second timing after the first timing. The first timing is when the non-solidified resin has extended into the first alignment mark and not yet into the second alignment mark. The second timing is when the non-solidified resin has extended into the first and second alignment marks.