Imprint Alignment Using Suction Chuck Warpage Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing imprint processes for semiconductor device manufacturing face challenges in maintaining accurate alignment of patterns due to substrate warpage caused by suction on vacuum chucks, leading to displacement of the transfer position and reduced overlapping accuracy.
Innovation Solution
The method involves using a suction chuck with distinct suction regions to manage warpage by adjusting suction forces, combined with alignment marks on both the substrate and template, and imaging sensors to align these marks for precise positioning, ensuring accurate pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is suctioned onto the vacuum chuck, then the substrate can be held and processed, but the substrate warps and the transfer position is displaced
Solution Approach 1:
The suction chuck is divided into multiple independent suction regions (first suction region and second suction region) with different suction forces. The first suction region applies a first suction force while the second suction region applies a second suction force, allowing differential control of substrate warpage to maintain both holding stability and transfer position accuracy
Solution Approach 2:
The suction forces in different regions are adjusted as variables to control the warpage amount of the substrate. By changing the suction force parameters in the first and second suction regions, the substrate warpage can be optimized to prevent transfer position displacement while maintaining reliable substrate holding
2Measurement precision
If alignment marks are used to align the transfer position, then the pattern can be positioned on the substrate, but substrate warpage causes the transfer position to be displaced from the intended position
Solution Approach 1:
The alignment marks are positioned in regions that are less affected by warpage (such as the center region), and the warpage control is performed in advance by adjusting suction forces before the actual pattern transfer, ensuring that the alignment marks remain accurate and the transfer position is correct
Solution Approach 2:
The system uses the alignment marks as reference points to detect substrate position and warpage, then feeds this information back to adjust the suction forces in different regions, creating a closed-loop control system that maintains both alignment accuracy and transfer position precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the overlapping accuracy of patterns on substrates by compensating for warpage and improving the alignment precision between the template and substrate, thereby improving the quality of semiconductor devices.
Implementation Method 1
a substrate can be suctioned onto a vacuum chuck
Data Source
AI summary
According to one embodiment, a pattern formation method includes holding a substrate on a suction chuck that an outer suction region for an outer edge portion of the substrate and an inner suction region for an inner region of the substrate. A partial shot region at an outer edge of the substrate has a first alignment mark in the inner region and a second alignment mark at the outer edge portion. While a template is being pressed against a resin film in the shot region, position alignment using the second and fourth alignment marks is performed by adjusting a suction force for the outer suction region for changing a warpage amount of the substrate while observing the second and fourth alignment marks through the template.