Imprint Apparatus Alignment via Wavelength Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing imprint apparatuses face challenges in achieving high accuracy alignment between a mold and a substrate due to position deviations occurring during the alignment process, particularly when using light-based detection methods.
Innovation Solution
An imprint apparatus equipped with a detection unit that irradiates marks on the mold and substrate with specific light, a heating unit to deform the substrate, and a control unit to adjust alignment based on detected position deviations, while minimizing interference from secondary light sources to maintain accurate detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light-based detection is used to measure position deviation between marks, then alignment can be performed, but detection accuracy decreases due to interference from reflected heating light
Solution Approach 1:
The patent divides the light detection process into separate wavelength channels. The detection unit uses a specific wavelength range for position deviation measurement, while the heating unit operates at a different wavelength range. This segmentation allows independent optimization of detection and heating functions without mutual interference.
Solution Approach 2:
The patent introduces a wavelength filter as an intermediary component in the optical path. This filter selectively transmits the detection wavelength while blocking the heating wavelength, thereby mediating between the heating light source and the detection system to prevent interference.
2Manufacturing precision
If the substrate is heated to deform the shot region for alignment correction, then alignment accuracy can be improved, but the heating light may interfere with position deviation detection
Solution Approach 1:
The patent segments the optical spectrum into distinct detection and heating wavelength bands. By assigning different wavelength ranges to detection and heating functions, the system can perform both operations simultaneously or sequentially without cross-interference, maintaining both alignment accuracy and detection precision.
Solution Approach 2:
The patent changes the wavelength parameter of light to differentiate between detection and heating functions. The detection unit operates at wavelengths optimized for mark detection, while the heating unit uses wavelengths optimized for substrate heating, with filters ensuring each function operates without affecting the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures high accuracy alignment between the mold and substrate by effectively detecting and correcting position deviations, preventing decreases in detection accuracy caused by secondary light interference, thus enhancing the overlay precision during the imprint process.
Implementation Method 1
a detection unit configured to irradiate a first mark of the mold and a second mark of the substrate with first light, detect the first light from the first mark and the second mark
Implementation Method 2
a heating unit configured to irradiate the substrate via the mold with second light for heating, and heat the substrate to deform the shot region
Data Source
AI summary
The present invention provides an imprint apparatus that molds an imprint material on a shot region of a substrate by using a mold, comprising a detection unit configured to detect first light with which a first mark of the mold and a second mark of the substrate are irradiated and measure a position deviation between the first mark and the second mark, a heating unit configured to irradiate the substrate with second light for heating the substrate and deforming the shot region, and a control unit configured to control alignment between the mold and the substrate based on the position deviation, wherein a parameter of the detection unit or the heating unit is set not to detect the second light by the detection unit while the first light is detected and the substrate is irradiated with the second light.