Imprint Apparatus Mold Substrate Deformation Control
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Solution Overview
Problem
Conventional imprint apparatus techniques face challenges in achieving accurate overlay between a mold and a substrate due to shape difference corrections affecting positional shifts and magnification shifts, leading to increased correction time and deterioration in overlay accuracy, with hysteresis issues from force deformation mechanisms and unintended thermal corrections.
Innovation Solution
An imprint apparatus with a control unit that feedback-controls mold and substrate deformation units to maintain shape differences within allowable ranges, using difference data, target deformation amounts, and time-series deformation data to perform precise shape control on both the mold and substrate, minimizing the impact of shape corrections on positional shifts and preventing hysteresis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If shape difference correction is performed between mold and substrate, then overlay accuracy is improved, but correction time increases and productivity deteriorates
Solution Approach 1:
The system performs preliminary shape correction on the substrate using thermal deformation before the imprinting process begins. By pre-heating the substrate to induce controlled thermal expansion, the shape of the shot region is adjusted in advance to match the mold pattern, eliminating the need for time-consuming corrections during the actual imprinting process.
Solution Approach 2:
The invention replaces the conventional force deformation mechanism with a thermal deformation mechanism. Instead of applying mechanical force to deform the substrate, the system uses controlled heating to induce thermal expansion, which naturally adjusts the substrate shape. This substitution eliminates hysteresis effects and provides more predictable, repeatable deformation behavior.
2Manufacturing precision
If force deformation mechanism is used for shape correction, then shape difference is corrected, but hysteresis occurs and overlay accuracy deteriorates
Solution Approach 1:
The invention replaces the force deformation mechanism with a thermal deformation mechanism. By using controlled heating to induce thermal expansion in the substrate, the system achieves shape correction without the hysteresis effects that plague mechanical force application. The thermal field provides continuous, reversible control over substrate deformation.
Solution Approach 2:
The system changes the physical state parameters of the substrate by controlling temperature. By adjusting the thermal field distribution and intensity, the substrate undergoes controlled thermal expansion that matches the mold pattern. This parameter-based control (temperature) provides more stable and predictable deformation compared to force-based control.
3Reliability
If thermal deformation mechanism is used for shape correction, then hysteresis is eliminated, but unintended thermal deformation may occur
Solution Approach 1:
The system applies thermal deformation locally to specific regions of the substrate rather than uniformly heating the entire substrate. By controlling the spatial distribution of the thermal field, only the shot region undergoes thermal expansion, while other areas remain unaffected. This localized approach prevents unintended deformation and maintains overall substrate integrity.
Solution Approach 2:
The system incorporates feedback control to monitor and adjust the thermal deformation process. By measuring the actual shape of the shot region and comparing it to the target shape, the control unit adjusts the thermal field parameters in real-time to achieve precise deformation matching, eliminating both under-correction and over-correction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate overlay between the mold and substrate in a shorter time, reducing the time required for correction and improving overlay accuracy by minimizing the influence of shape corrections on positional shifts and preventing hysteresis.
Implementation Method 1
a substrate deformation unit configured to deform the shot region on the substrate by applying heat to the substrate
Implementation Method 2
a mold deformation unit configured to deform the pattern region of the mold by applying a force to the mold
Data Source
AI summary
The present invention provides an imprint apparatus including a control unit that feedback-controls a mold deformation unit based on difference data indicating a shape difference between a pattern region of a mold and a shot region on a substrate, target data indicating a relative target deformation amount between the pattern region of the mold and the shot region on the substrate, and time series data indicating a relative deformation amount between the pattern region of the mold and the shot region on the substrate which changes at each time while performing shape control on the shot region.