Imprint Apparatus UV Light Position Alignment
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Solution Overview
Problem
The existing imprinting methods face challenges in accurately preventing the extrusion of imprint material beyond the pattern formation area due to displacement errors in the mold's position relative to the UV light irradiation, leading to incomplete pattern formation and material loss.
Innovation Solution
An imprint apparatus equipped with a mold measurement unit, light modulation element, and control unit that measures and adjusts the position of the irradiation light to align with the mold's pattern formation area, ensuring precise application of UV light and reducing material extrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If UV light is applied to the outside of the pattern formation area to cure imprint material, then material extrusion is prevented, but positioning accuracy deteriorates due to mold conveyance error
Solution Approach 1:
The system performs preliminary measurement of the mold's pattern formation area position using the mold measurement unit before the actual imprinting process. This advance measurement allows the control unit to pre-calculate and set the correct UV light irradiation position, ensuring that when imprinting occurs, the UV light is already positioned accurately relative to the mold pattern even accounting for conveyance errors.
Solution Approach 2:
The system implements a feedback loop where the mold measurement unit continuously monitors the position of the mold's pattern formation area, and the irradiation light measurement unit monitors the UV light position. The control unit uses this feedback information to dynamically adjust and align the UV light position with the mold pattern position, compensating for any conveyance errors and maintaining precise positioning throughout the process.
2Illumination intensity
If spatial light modulation element is used to form UV light irradiation pattern, then light intensity distribution is controlled, but positioning accuracy deteriorates due to mold displacement
Solution Approach 1:
The system makes the UV light irradiation pattern dynamic and adjustable rather than fixed. The light modulation element can change the irradiation pattern in real-time based on feedback from the measurement units. This dynamic capability allows the system to adapt to mold position variations and maintain accurate alignment between the UV light and mold pattern throughout the imprinting process.
Solution Approach 2:
The system changes the parameters of the UV light irradiation (position, intensity distribution) based on measured mold position data. The control unit adjusts the irradiation light parameters to match the actual mold pattern position, ensuring that the UV light remains accurately positioned relative to the mold even when conveyance errors occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents imprint material extrusion by accurately aligning the UV light with the mold's pattern, ensuring complete pattern formation and reducing material loss during the imprinting process.
Implementation Method 1
a mold measurement unit configured to measure a position of the pattern formation area of the mold
Implementation Method 2
a light modulation element configured to control an intensity distribution of irradiation light applied to the substrate
Implementation Method 3
an irradiation light measurement unit configured to measure a position of the irradiation light
Implementation Method 4
After the imprint material is cured in a state in which the imprint material and the mold are in contact with each other
Data Source
AI summary
An imprint apparatus that forms a pattern of an imprint material on a substrate using a mold having a pattern formation area. The imprint apparatus includes a mold measurement unit configured to measure a position of the pattern formation area of the mold, a light modulation element configured to control an intensity distribution of irradiation light applied to the substrate, an irradiation light measurement unit configured to measure a position of the irradiation light, and a control unit configured to control the position of the irradiation light with respect to the position of the pattern formation area based on a measurement result of the position of the pattern formation area by the mold measurement unit and a measurement result of the position of the irradiation light by the irradiation light measurement unit.