Imprint Planarized Film Formation With Partial-Contact Alignment

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Solution Overview

Problem

Existing methods struggle to achieve sufficient planarization performance for nanoscale steps on substrates, particularly in semiconductor manufacturing, leading to uneven residual film thickness and pattern shape inconsistencies.

Innovation Solution

A film formation method using an imprint technique with a mold that applies a composition to a substrate, followed by precise alignment and partial preliminary curing before full contact, improving alignment accuracy and planarization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a composition is supplied onto a substrate with steps using conventional coaters, then the substrate can be coated, but sufficient planarization performance cannot be obtained for nanoscale steps

Engineering Contradiction:

Improveplanarization accuracyVSAvoidcoating process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

A mold is introduced as an intermediary tool to achieve nanoscale planarization. The mold contacts the composition on the substrate and applies pressure to fill in nanoscale steps, enabling precise planarization that conventional coaters cannot achieve. The mold acts as a mediator between the composition and substrate surface irregularities.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The mold is brought into contact with the composition before final curing occurs. This preliminary contact allows the composition to flow and fill nanoscale steps while still in a moldable state, achieving planarization before the composition hardens and locks in the flattened surface topology.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If a mold is used to planarize the substrate by molding the composition, then planarization accuracy is improved, but alignment accuracy between the mold and substrate becomes critical

Engineering Contradiction:

Improveplanarization accuracyVSAvoidalignment accuracy

Core Design Contradiction:

Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The mold is brought into contact with the composition at a first location (partial contact) before full alignment is achieved. This partial contact allows the mold to be positioned and aligned with the substrate while maintaining contact with the composition, enabling alignment adjustments without complete separation and re-contact.

Inventive Principle:

Principle #16Partial or excessive action

Solution Approach 2:

The system transitions from a static contact state to a dynamic alignment process. The mold can be moved and adjusted while in contact with the composition, allowing real-time alignment corrections. The composition's moldable state provides a buffer that accommodates dynamic positioning adjustments.

Inventive Principle:

Principle #15Dynamics

3Area of stationary object

If the mold is brought into full contact with the composition before alignment, then the entire surface is covered, but alignment accuracy deteriorates due to loss of positional control

Engineering Contradiction:

Improvecontact areaVSAvoidalignment accuracy

Core Design Contradiction:

Area of stationary objectVSMeasurement precision

Solution Approach 1:

The mold contacts the composition at a first location (partial contact) before full alignment is achieved. This partial contact allows the mold to be positioned and aligned with the substrate while maintaining contact with the composition, enabling alignment adjustments without complete separation and re-contact.

Inventive Principle:

Principle #16Partial or excessive action

Solution Approach 2:

Alignment is performed as a preliminary action before the mold is fully pressed into the composition. The mold is initially brought into contact at a limited area, allowing alignment adjustments to be made while the composition is still in a moldable state, ensuring precise positioning before complete contact and curing.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances alignment accuracy and achieves even film thickness across the substrate surface, addressing the limitations of conventional methods in nanoscale planarization.

Implementation Method 1

bringing a circular region of a mold, in which the planarized film should be formed, into contact with a composition on the substrate

Methodology Applied

Scientific EffectPressure-driven flow: Pressure Gradient

Implementation Method 2

the molded composition is cured by, for example, UV exposure, thereby forming a planarized film

Methodology Applied

Scientific EffectPhotocuring: Photopolymerisation

Data Source

PatentUS20260060044A1Film formation method and article manufacturing method

Publication Date: 2026.02.26 CANON KK

AI summary

A film formation method of forming a planarized film on a substrate, includes bringing a circular region of a mold, in which the planarized film should be formed, into contact with a composition on the substrate, performing alignment between the substrate and the mold in a state in which the composition and the mold are in contact, and applying curing energy to the composition after the performing alignment, wherein after a part of the mold contacts the composition in the bringing the mold into contact with the composition, the performing alignment is started before an entire surface of the circular region of the mold contacts the composition.