Imprint Device Gas Mixture for Resist Filling
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Solution Overview
Problem
In nano-imprint technology, capillary condensation occurs due to low saturated vapor pressure gases, leading to resist filling failures and patterning inaccuracies in microgroove patterns with line widths of 100 nm or less, restricting dimensional control and increasing manufacturing costs.
Innovation Solution
An imprint device that uses a mixture of condensable gases with different saturated vapor pressures to prevent capillary condensation, allowing for precise control of pattern line widths and shapes by adjusting the ratio of gases, thereby avoiding dew condensation and ensuring accurate transfer of mold patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a condensable gas with low saturated vapor pressure is used to prevent air entrapment during imprinting, then transfer accuracy is improved, but capillary condensation occurs in microgroove patterns causing resist filling failures
Solution Approach 1:
The patent changes the physical parameters of the gas environment by introducing a mixed gas atmosphere composed of a condensable gas and a non-condensable gas. By adjusting the composition ratio and controlling temperature and pressure parameters, the system prevents capillary condensation while maintaining adequate vapor pressure to eliminate air entrapment, thus resolving the contradiction between transfer accuracy and resist filling reliability
Solution Approach 2:
The patent uses a composite gas atmosphere combining two types of gases with different properties: a condensable gas (for preventing air entrapment) and a non-condensable gas (for preventing capillary condensation). This composite approach allows the system to leverage the benefits of both gas types while mitigating their individual drawbacks, achieving both high transfer accuracy and reliable resist filling
2Manufacturing precision
If the pressure used to press the mold is increased to decrease air volume, then transfer accuracy is improved, but the mold deforms making high accuracy transfer impossible
Solution Approach 1:
The patent changes the pressure parameters to relatively low levels (0.05-2.0 MPa) and compensates for the reduced compressive force by introducing a condensable gas atmosphere. The condensable gas fills void spaces and prevents air entrapment without requiring excessive mold pressure, thereby maintaining mold shape integrity while achieving accurate pattern transfer
Solution Approach 2:
The condensable gas acts as an intermediary substance between the mold and resist. It fills the space between mold features and resist material, preventing air entrapment and enabling complete resist filling at lower pressures. This intermediary role allows accurate transfer without subjecting the mold to deforming high pressures
3Manufacturing precision
If a vacuum environment is used to prevent air entrapment, then transfer accuracy is improved, but the operation chamber becomes complex requiring robust vacuum survival capability
Solution Approach 1:
The patent replaces the vacuum environment with an inert-like condensable gas atmosphere that can be maintained at atmospheric or slightly elevated pressures. This gas atmosphere prevents air entrapment during imprinting while allowing the use of simple, robust operation chambers without complex vacuum systems, thereby reducing device complexity while maintaining transfer accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-accuracy nano-imprinting with flexible pattern dimensions, allowing for various line widths to be achieved using a single mold, reducing manufacturing time and costs by preventing capillary condensation and ensuring reliable pattern formation.
Implementation Method 1
a condensable gas which condenses at a temperature and a pressure in the concave portion when the layer of the resist enters into the concave portion formed in the mold
Implementation Method 2
there has been known a phenomenon called 'capillary condensation' that occurs due to the influence of a capillary force acting in a micro space
Data Source
AI summary
An imprint device according to the present invention is provided with a supply device that supplies a plurality of condensable gases, which have different saturated vapor pressures, at a fixed ratio by a first condensable gas tank (6) and a control valve (6a) and a second condensable gas tank (6) and a control valve (7a) when a concave portion formed in a mold is transferred in an atmosphere of a condensable gas, which condenses at a temperature and a pressure in the concave portion, the concave portion being sealed by a resist layer that enters into the concave portion formed in the mold (3). The imprint device makes it possible to prevent resist filling failure caused by capillary condensation and to adjust pattern line width and shape by using the same mold.