Imprint Apparatus Heating Mechanism for Overlay Precision
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Solution Overview
Problem
The existing imprint techniques face challenges in maintaining overlay precision due to the deterioration of optical modulators when exposed to high-power laser light, leading to shifts in irradiation position and uneven illuminance, which affects the matching of substrate and mold patterns.
Innovation Solution
The use of a heating mechanism with multiple optical modulators that form distinct illuminance distributions across the substrate, allowing for precise thermal deformation and alignment of substrate patterns by adjusting the tilt and position of light beams from multiple DMDs or other optical modulators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single optical modulator is irradiated with high-power laser light for substrate heating, then thermal deformation capability is improved, but the functionality of the optical modulator deteriorates due to micro-mirror surface errors and reduced reflectance
Solution Approach 1:
The patent divides the single optical modulator into multiple optical modulators (first and second optical modulators). Each optical modulator handles a portion of the light beam, reducing the power burden on each individual device. This segmentation allows the system to achieve the required heating capability while each modulator operates within safe power limits, preventing deterioration.
Solution Approach 2:
The patent combines multiple optical modulators to work together in unison. The light beams from multiple modulators are merged and superimposed on the substrate, achieving the cumulative heating effect of high-power irradiation without requiring any single modulator to handle the full power load. This merging approach maintains both heating capability and modulator reliability.
2Manufacturing precision
If high-power laser light is used for substrate heating, then thermal deformation precision is improved, but irradiation position shifts and illuminance becomes uneven
Solution Approach 1:
By segmenting the heating task across multiple optical modulators, each operating at lower power levels, the patent avoids the position shifts and illuminance non-uniformity that occur with high-power single-source irradiation. The segmented approach allows for better control and stability of the light beam position.
Solution Approach 2:
The patent employs a control unit that coordinates multiple optical modulators, enabling precise control of the combined light beam. The system can adjust and optimize the illumination distribution by controlling each modulator's contribution, ensuring uniform illuminance and accurate irradiation positioning through coordinated feedback control.
3Device complexity
If a single optical modulator is used for illuminance distribution, then device complexity is reduced, but overlay precision deteriorates due to position shifts and illuminance non-uniformity
Solution Approach 1:
The patent uses multiple optical modulators instead of a single device. Each modulator contributes to the overall illuminance distribution, and their combined effect achieves superior pattern matching precision. The segmentation of the optical modulation function enables better control over the illumination profile.
Solution Approach 2:
The control unit coordinates multiple optical modulators to achieve precise illuminance distribution across the substrate. By controlling each modulator's light beam individually and combining them, the system can optimize the illumination uniformity and position accuracy, thereby improving overlay precision between substrate and mold patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances overlay precision by ensuring accurate matching of substrate and mold patterns, reducing the risk of pattern deformation and improving the quality of microfabrication in semiconductor devices and MEMS.
Implementation Method 1
To irradiate a substrate with light to thermally deform the substrate by absorbed heat thereof
Implementation Method 2
the substrate-side pattern area is irradiated therewith so that the substrate-side pattern area is deformed by absorbed heat thereof
Data Source
AI summary
An imprint apparatus forms a pattern of an imprint material in a shot area of the substrate using the mold, and includes a heating mechanism that changes a shape of the substrate by irradiating the shot area of the substrate with light, wherein the heating mechanism includes a plurality of optical modulators that forms an illuminance distribution in the shot area of the substrate, and light beams from the plurality of optical modulators illuminate mutually different areas of the shot area.