Imprint Apparatus Ion Flow Control for Charge Removal
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Solution Overview
Problem
The imprint apparatus faces challenges in efficiently removing electric-charge from molds after separation, leading to particle attraction and potential defects in pattern formation or mold damage due to ion concentration decreases when the substrate is moved.
Innovation Solution
An imprint apparatus equipped with an ion generator and supplier to ionize a gas, which is then controlled to maintain ion concentration by increasing the flow rate of the ionized gas under the mold, ensuring efficient charge removal and preventing particle adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is moved from the space under the mold after separation, then the substrate can be replaced or new imprint material can be supplied, but the ion concentration in the space decreases causing inefficient charge removal
Solution Approach 1:
The gas supply system dynamically adjusts the flow rate of ionized gas based on the substrate position. When the substrate moves away from the imaging space, the system increases gas flow rate to maintain ion concentration for effective charge removal, and reduces flow rate when substrate is present to prevent ion concentration decrease
Solution Approach 2:
The system changes the flow rate parameter of ionized gas supply according to operational phases. During substrate replacement when the space is empty, the flow rate is increased to maintain high ion concentration for charge removal. During imprinting when substrate is in position, the flow rate is reduced to avoid diluting the ion concentration in the imaging space
2Reliability
If ionized gas is supplied continuously at high flow rate, then charge removal efficiency is maintained, but ion concentration decreases when substrate is moved away causing inefficient charge removal
Solution Approach 1:
The gas supply system dynamically adjusts the flow rate of ionized gas based on the substrate position. When the substrate moves away from the imaging space, the system increases gas flow rate to maintain ion concentration for effective charge removal, and reduces flow rate when substrate is present to prevent ion concentration decrease
Solution Approach 2:
The control unit receives information about substrate position and adjusts the gas flow rate accordingly. When the substrate is detected to be moved away from the imaging space, the control unit increases the gas flow rate to maintain ion concentration, creating a feedback loop that maintains optimal ion concentration based on real-time operational state
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively stabilizes ion supply to the mold, preventing charge-related defects and maintaining efficient operation by maintaining ion concentration during substrate movement, thus ensuring accurate pattern formation and mold integrity.
Implementation Method 1
a generator configured to generate ionized gas by ionizing a first gas
Implementation Method 2
a phenomenon occurs in which the mold and the cured imprint material become charged by separating the mold from the imprint material... supply the imprint material onto the substrate or change the substrate
Data Source
AI summary
The present invention provides an imprint apparatus which forms a pattern of an imprint material on a substrate by using a mold, the apparatus comprising: a generator configured to generate ionized gas by ionizing a first gas; a supplier configured to supply a second gas including the ionized gas generated by the generator to a space under the mold; and a controller configured to control a flow rate of the second gas supplied by the supplier to the space, wherein the controller increases the flow rate of the second gas supplied from the supplier to the space so as to reduce a decrease in an ion concentration in the space caused by moving the substrate from the space after the mold is separated from the cured imprint material.