Imprint Lithography Mold for Uniform Fill Factor Metrology Standards
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Solution Overview
Problem
Conventional methods for manufacturing metrology standards face challenges in repeatably producing reliable and accurate features with minimal dimensional variability, leading to time-consuming post-process characterization and low yield rates.
Innovation Solution
A method involving imprint lithography where a flowable material is formed on a substrate with features arranged to provide a uniform fill factor, minimizing thickness variations and allowing for precise control of feature dimensions by optimizing the layer thickness and pattern density, and using a mold with recessions and protrusions to replicate features with minimal distortion during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processes (e-beam lithography, optical lithography) are used to manufacture metrology standards, then features can be formed with controlled dimensions, but post-process characterization is time-consuming and yield rate is low
Solution Approach 1:
The patent applies preliminary action by pre-forming master features with precise dimensions using e-beam lithography, then using these master features as templates for imprint lithography. This preliminary creation of accurate reference features enables subsequent high-yield replication without requiring post-process characterization of each replicated feature, thus resolving the contradiction between manufacturing precision and productivity
Solution Approach 2:
The patent employs copying through imprint lithography where a mold containing master features is used to replicate features across multiple substrates. The master features serve as the source copy, and the imprint process creates accurate replicas, eliminating the need for time-consuming post-process characterization and significantly increasing production yield while maintaining dimensional control
2Productivity
If features are densely packed to increase production capacity, then productivity increases, but thickness variations due to density variations increase
Solution Approach 1:
The patent applies local quality by varying the fill factor of features in different regions of the layer. Instead of uniform feature distribution, the design intentionally creates regions with different feature densities to compensate for thickness variations. This local adjustment of feature quality enables uniform thickness control even when features are densely packed, resolving the contradiction between productivity and manufacturing precision
3Measurement precision
If feature dimensions are reduced to a few nanometers to meet metrology requirements, then measurement precision improves, but dimensional variability increases
Solution Approach 1:
The patent uses copying through imprint lithography where master features of precise nanometer dimensions are replicated with high fidelity. The mold-based replication process maintains dimensional accuracy at the nanometer scale, enabling both high measurement precision and low dimensional variability simultaneously
Solution Approach 2:
The patent applies parameter changes by optimizing the fill factor and spacing of features to control thickness variations. By adjusting these geometric parameters, the process maintains uniform thickness even for features reduced to a few nanometers, thereby achieving both high measurement precision and low dimensional variability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reliable production of precision features with reduced dimensional variability, improving control over feature dimensions and increasing production yield by minimizing visco-elastic behavior and etch differential issues, allowing for features on the order of a few nanometers.
Implementation Method 1
A mold makes mechanical contact with the polymerizable fluid composition. The mold includes a relief structure, and the polymerizable fluid composition fills the relief structure.
Implementation Method 2
The polymerizable fluid composition is then subjected to conditions to solidify and polymerize the same, forming a solidified polymeric material on the planarization layer that contains a relief structure complimentary to that of the mold.
Implementation Method 3
The planarization layer and the solidified polymeric material are subjected to an environment to selectively etch the planarization layer relative to the solidified polymeric material such that a relief image is formed in the planarization layer.
Data Source
AI summary
The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.