Imprint Lithography Void Detection via Optical Feedback

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Solution Overview

Problem

Imprint lithography methods face challenges in reducing the time required to fill voids between the imprintable liquid medium and the patterned surface, leading to low throughput rates and potential defects in the resulting patterned layer, especially in UV-imprint lithography techniques like SFIL.

Innovation Solution

The method involves measuring light emergent from the interface between the imprintable liquid medium and the patterned surface during the filling period to obtain data on voids, deriving an estimated end time for filling based on this data, and adjusting the processing steps accordingly, allowing for earlier commencement of curing or further processing without increasing defect levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the filling period is extended to ensure complete filling of voids, then manufacturing precision is improved, but productivity deteriorates

Engineering Contradiction:
Improvefilling completenessVSAvoidthroughput rate
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The system uses an optical sensor to detect the presence of voids at the interface between the imprintable liquid medium and the patterned surface during the filling period. This real-time feedback allows the system to monitor filling progress and determine when filling is complete, enabling precise control of the filling period duration to avoid both incomplete filling and excessive waiting time.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The optical detection system is positioned to monitor the filling process in advance, allowing the system to detect voids before they become defects in the cured layer. By detecting voids during the filling period and adjusting the process accordingly, the system ensures complete filling without requiring excessive filling time.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the filling period is shortened to increase throughput, then productivity is improved, but manufacturing precision deteriorates

Engineering Contradiction:
Improvethroughput rateVSAvoidfilling completeness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The optical sensor provides real-time feedback on void presence during the filling period, allowing the system to determine the exact moment when filling is complete. This enables the system to use the minimum necessary filling time to achieve complete filling, maximizing throughput without sacrificing filling completeness.

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If the holding period is extended to ensure proper curing, then manufacturing precision is improved, but productivity deteriorates

Engineering Contradiction:
Improvecuring qualityVSAvoidthroughput rate
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

By using optical detection to confirm complete filling before initiating the holding period for curing, the system ensures that the holding period only needs to accommodate the curing process itself, not also compensate for incomplete filling. This reduces the required holding period duration while maintaining curing quality.

Inventive Principle:
Principle #10Preliminary action

4Manufacturing precision

If real-time monitoring is implemented to detect voids, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvevoid detection accuracyVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system replaces complex mechanical or computational void detection methods with a simple optical sensor that detects voids based on light transmission or reflection differences. This optical approach provides accurate void detection during the filling period with minimal added system complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the filling and holding periods, enhancing the throughput of the imprint lithography process while minimizing defects by ensuring voids are filled efficiently, allowing for more rapid separation of the imprint template and substrate without increasing defect rates.

Implementation Method 1

measuring light emergent from an interface between the imprintable liquid medium and the patterned surface during the filling period to obtain data concerning one or more voids at the interface

Methodology Applied
Scientific EffectLight measurement: Light

Implementation Method 2

illuminating the UV-curable imprintable liquid medium with UV-radiation for an illumination period

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Data Source

PatentUS9547235B2Imprint lithography apparatus and method
Publication Date: 2017.01.17 ASML NETHERLANDS BV
  • US9547235B2 patent drawing
  • US9547235B2 patent drawing
  • US9547235B2 patent drawing

AI summary

An imprint lithography method is disclosed for forming a patterned layer from an imprintable liquid medium on a substrate by means of an imprint template having a patterned surface. The method involves contacting the patterned surface and imprintable liquid medium together for a filling period. Light emergent (e.g., scattered or reflected) from an interface between the medium and the patterned surface is collected and measured during the filling period to obtain data concerning one or more voids at the interface, and an estimated end time for the filling period is derived from a relationship between the data and time. The method may allow subsequent process steps to be undertaken more rapidly, with reduced risk of defects arising from remnants of unfilled voids. An imprint lithography apparatus and component for putting the method into effect are also disclosed.