Imprint Lithography Substrate Table Swapping
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Solution Overview
Problem
Current lithographic techniques face challenges in achieving high resolution and accuracy due to diffraction limitations, material transparency issues, and mechanical deformation during the imprinting process, particularly at sub-100 nm feature sizes, which complicates the manufacturing of integrated circuits and other devices.
Innovation Solution
The development of an imprint lithography apparatus with movable substrate tables and multiple imprintable medium dispensers allows for efficient swapping positions and precise alignment, enabling the use of hot and UV imprint lithography processes with reduced temperature and pressure requirements, thereby minimizing pattern distortion and enhancing overlay accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If imprint lithography is used to achieve sub-100 nm features, then resolution is improved, but pattern distortion increases due to mechanical deformation during imprinting
Solution Approach 1:
The patent employs dynamic temperature and pressure control during the imprinting process. The system adjusts temperature to transition the imprintable medium between flowable and solid states, and modulates pressure application timing to minimize mechanical deformation. This dynamic control reduces pattern distortion while maintaining sub-100 nm resolution capability.
Solution Approach 2:
The invention changes physical parameters of the imprintable medium by controlling temperature and pressure. By heating the medium to increase flowability during imprinting and then cooling it to stabilize the pattern, the system achieves high resolution while minimizing distortion. Pressure parameters are also adjusted to optimize contact between template and substrate without causing excessive deformation.
2Productivity
If substrate tables swap positions between dispenser and template holder, then throughput is improved, but alignment precision may deteriorate
Solution Approach 1:
The patent replaces mechanical alignment systems with optical or electromagnetic field-based alignment methods. Sensors detect alignment marks or patterns on the substrate and provide feedback for precise positioning. This substitution enables accurate realignment after table swapping, maintaining overlay accuracy while achieving high throughput through rapid position exchanges.
Solution Approach 2:
The invention implements feedback control for substrate table positioning. Alignment sensors continuously monitor the position of substrates relative to the template holder, and control systems adjust table positions to compensate for any misalignment. This feedback mechanism ensures high overlay accuracy is maintained despite frequent table swapping operations.
3Stability of the object's composition
If temperature and pressure are reduced during imprinting, then pattern distortion is minimized, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes phase transitions of the imprintable medium to simplify the imprinting process. By heating the medium above its glass transition or melting temperature, it becomes flowable and easily conforms to the template pattern. After imprinting, cooling solidifies the medium, locking in the pattern with minimal distortion. This phase transition approach eliminates the need for complex high-pressure systems while maintaining pattern fidelity.
Solution Approach 2:
The invention employs a disposable or single-use imprintable medium layer that is applied to the substrate, used for one imprinting cycle, and then removed or replaced. This eliminates the need for complex cleaning and maintenance systems, reducing manufacturing complexity while allowing optimized low temperature and pressure processing for each new medium layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases throughput and reduces pattern distortion, allowing for higher resolution and accuracy in feature printing, particularly suitable for integrated circuit manufacturing and other high-density applications.
Implementation Method 1
The UV source is arranged to illuminate the imprintable medium beneath the imprint template
Implementation Method 2
enabling the use of hot and UV imprint lithography processes with reduced temperature and pressure requirements
Data Source
AI summary
A lithographic apparatus is disclosed that has a first substrate table arranged to hold a substrate and a second substrate table arranged to hold a substrate, an imprint template holder arranged to hold an imprint template, and an imprintable medium dispenser, wherein the first substrate table is moveable between a first position located at or adjacent to the imprintable medium dispenser, and a second position located at or adjacent to the imprint template holder, and the second substrate table is moveable between the first and second positions, such that the first and second substrate tables swap positions.