Imprint Material for Nanoimprint Lithography with Low Mold Release Force
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current imprint materials for nanoimprint lithography face challenges in achieving low mold release force, low plastic deformation, high heat resistance, and crack resistance, especially at temperatures over 200°C, which affects the durability and reliability of pattern-transferred films in applications like semiconductor devices and displays.
Innovation Solution
A composition comprising a compound with a C4-10 linear or branched hydrocarbon group, a silsesquioxane compound with multiple polymerizable groups, and a silicone compound with polymerizable groups on its ends, along with a photopolymerization initiator, is used to create an imprint material with a low mold release force, low plastic deformation rate, and high heat resistance, preventing degradation and cracking at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If conventional imprint materials are used, then the material can be cured and form a pattern, but the mold release force becomes large causing the cured resin to adhere to the mold
Solution Approach 1:
The patent changes the chemical composition parameters of the imprint material by incorporating specific silicone compounds and silsesquioxane compounds with controlled polymerizable group contents. This composition modification reduces the mold release force to 0.1-0.7 g/cm while maintaining proper curing characteristics, allowing reliable mold release without adhesion problems.
Solution Approach 2:
The patent creates a composite material system combining silicone compounds, silsesquioxane compounds, and polymerizable compounds in specific ratios. This composite approach achieves both low mold release force and adequate adhesion to the substrate, resolving the contradiction between easy mold release and proper film formation.
2Strength
If the resin film is subjected to external force during manufacturing, then the film may deform, but low plastic deformation characteristic is required for device manufacturing
Solution Approach 1:
The patent modifies the mechanical properties of the cured film by adjusting the composition ratios of silicone compounds, silsesquioxane compounds, and polymerizable compounds. This results in a cured film with low plastic deformation characteristics that maintains its shape under external forces during device manufacturing processes.
3Temperature
If the resin film is heated to high temperatures (around 265°C) during manufacturing processes, then heating is achieved, but degradation products sublime causing contamination
Solution Approach 1:
The patent changes the thermal stability parameters of the imprint material through specific compound selection and ratio optimization. The cured film achieves high heat resistance where no degradation products sublime even at 265°C, eliminating contamination of devices and manufacturing equipment while allowing necessary heating processes.
4Length of stationary object
If the film thickness is increased for device applications, then the film can meet structural requirements, but the film becomes more prone to cracking during cooling
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the cured film through composition optimization. The resulting film has improved crack resistance that allows it to withstand rapid cooling from high temperatures without cracking, even when the film thickness is increased to meet structural requirements for various devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured film exhibits a low mold release force, low plastic deformation, and excellent heat resistance, preventing sublimation and cracking even at 265°C, making it suitable for thick films and applications in solar cells, LED devices, and displays.
Implementation Method 1
a composition comprising a compound with a C4-10 linear or branched hydrocarbon group, a silsesquoxane compound with multiple polymerizable groups, and a silicone compound with polymerizable groups on its ends, along with a photopolymerization initiator
Data Source
AI summary
A novel imprint material and film produced from the material, on which a pattern is transferred. An imprint material having: a component (A); a component (B); a component (C); and a component (D), wherein, (A): a compound of Formula (1), Formula (2), or Formula (3):wherein, X is C1-5 linear alkylene, R1 is H or CH3; each of R2, R3, and R4 is independently H, CH3, or C2H5; and the sum of the number of carbon atoms on R2, R3, and R4 is 0 to 2; (B): a silsesquioxane compound having a repeating unit of Formula (4), and having two or more polymerizable groups of Y; (C): a silicone compound having a repeating unit of Formula (5), and having two polymerizable groups on its ends:wherein, each of R6 and R7 is independently C1-3 alkyl; R5 is C1-3 alkylene; and k is 0 to 3; and (D): photopolymerization initiator.