Imprint Material Supply Pattern for Residual Layer Uniformity
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Solution Overview
Problem
Existing imprint methods fail to ensure uniform residual layer thickness across the substrate due to inadequate consideration of imprint material filling patterns, leading to non-uniform pattern shapes and increased defects.
Innovation Solution
The method involves dividing the mold into regions based on pattern information to calculate and optimize the arrangement of imprint material drops, taking into account the anisotropy of spreading, to achieve uniform residual layer thickness by creating a customized supply pattern that accounts for different areas on the mold surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a uniform amount of imprint material is supplied across the entire mold surface, then the supply process is simple, but the residual layer thickness becomes non-uniform due to different filling patterns in different regions
Solution Approach 1:
The mold surface is divided into multiple regions based on pattern information, and the supply pattern is determined separately for each region. This segmentation allows the filling behavior of imprint material to be optimized for each specific area, ensuring uniform residual layer thickness across the entire substrate while maintaining manageable process complexity through systematic regional treatment
Solution Approach 2:
Different supply patterns are applied to different regions of the mold according to their specific filling characteristics. By tailoring the imprint material supply pattern to local requirements of each region, the method achieves optimal filling performance and uniform residual layer thickness in each area, rather than applying a one-size-fits-all approach
2Manufacturing precision
If the imprint material supply pattern is optimized for each region, then the uniformity of residual layer thickness is improved, but the calculation and process complexity increases
Solution Approach 1:
The mold surface is divided into multiple regions based on pattern information, and the supply pattern is determined separately for each region. This segmentation allows the filling behavior of imprint material to be optimized for each specific area, ensuring uniform residual layer thickness across the entire substrate while maintaining manageable process complexity through systematic regional treatment
Solution Approach 2:
The supply pattern is calculated in advance based on pattern information and filling patterns before the actual imprint process. This preliminary calculation of regional supply patterns enables the system to pre-determine the optimal material distribution, avoiding complex real-time calculations during manufacturing while achieving precise control over residual layer uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a uniform residual layer thickness with reduced defects, improving the overall quality and productivity of pattern formation on substrates, such as semiconductor devices and magnetic storage media.
Implementation Method 1
a photocuring method in which a photocurable resin is used as an imprint material
Data Source
AI summary
There is provided a method for use in molding an imprint material supplied onto a substrate with a mold to form a pattern on the substrate, the method comprising steps of: with respect to each of regions obtained by dividing a region of the mold based on information of a pattern of the mold, obtaining first information of a first arrangement pattern of the imprint material based on information of the pattern of the mold; obtaining second information of a second arrangement pattern of the imprint material based on information of a thickness of a residual layer of the pattern to be formed on the substrate; and obtaining third information of a third arrangement pattern of the imprint material to be arranged on the substrate based on the first information and the second information.