Imprint Mold Contact State Detection for Pattern Defect Prevention
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Solution Overview
Problem
Existing imprint techniques face defects in pattern formation due to foreign substances on the mold or substrate, uneven substrate thickness leading to uneven force application, and potential damage to the mold during the contact and mold releasing processes, which can result in pattern defects or mold damage.
Innovation Solution
An information processing apparatus connected to a molding apparatus that captures images of the substrate and mold using an image capturing unit to detect the contact state between the mold and the imprint material, allowing for gradual contact and separation, and outputs information on the contact state based on the captured images to prevent abnormalities during the imprint process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold and substrate are brought into contact via the imprint material, then the pattern can be transferred to the substrate, but foreign substances may adhere to the mold or substrate causing defects in the formed pattern
Solution Approach 1:
The patent performs preliminary detection of foreign substances on the mold and substrate before the imprint process using an imaging system. This advance detection allows the system to identify contamination issues before they affect pattern transfer, enabling preventive measures to be taken.
Solution Approach 2:
The patent implements a feedback mechanism where the imaging system continuously monitors the contact state between mold and substrate during the imprint process. The detected information is fed back to the control unit, which can adjust process parameters or alert operators to maintain pattern transfer quality.
2Measurement precision
If the thickness of the substrate is uneven, then a force is unevenly applied within the contact surface, but this can be detected by imaging the contact state between mold and substrate
Solution Approach 1:
The patent uses an imaging system to detect the contact state between mold and substrate, which reveals information about substrate thickness uniformity. The control unit receives this feedback and can identify regions with uneven thickness that may lead to defective pattern formation, allowing for process adjustment or substrate rejection.
3Manufacturing precision
If the mold and substrate are brought into contact gradually to increase contact area, then better pattern transfer is achieved, but foreign substances or uneven substrate thickness can still cause defects
Solution Approach 1:
The patent implements real-time imaging monitoring during the gradual contact process between mold and substrate. The control unit analyzes the contact state information to detect foreign substances or substrate thickness issues as they affect pattern formation, providing feedback that ensures process reliability throughout the gradual contact sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents pattern defects and mold damage by detecting and addressing abnormalities in the contact and mold releasing processes, enhancing the accuracy and reliability of the imprint process.
Implementation Method 1
an image capturing unit configured to capture an image by irradiating the substrate with light via the mold, and detecting reflected light from the mold and reflected light from the substrate
Implementation Method 2
the imprint material is cured by irradiation with light such as ultraviolet light
Data Source
AI summary
The present invention provides an information processing apparatus including a processing unit configured to perform a process of outputting information indicating a contact state between a mold and a composition on a substrate, wherein the processing unit obtains a plurality of points representing a contour shape of a portion where the mold and the composition on the substrate are in contact with each other while at least one process of a contact process and a mold releasing process is performed, and outputs the information indicating the contact state based on the plurality of points.