Imprint Mold Deformation for Bubble Reduction
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Solution Overview
Problem
Conventional imprint technologies face issues with air bubbles entrapped between the mold and substrate, leading to pattern defects, and excessive peel-off stress during mold release, which can cause resin pattern distortion and incomplete filling of the mold concave portions.
Innovation Solution
An imprint apparatus with a holder and pressure reduction device that reduces back pressure in parallel with mold release, using a mold deformation mechanism to control deformation and minimize air bubble entrapment by adjusting pressure and gas supply during both mold contacting and releasing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold is pressed against the resin on the substrate, then the resin pattern is formed, but air bubbles are entrapped in the resin pattern-forming unit
Solution Approach 1:
The mold is temporarily deflected toward the substrate in a convex shape before the imprinting operation, creating a gap that allows air bubbles to escape. This preliminary deformation prevents air bubble entrapment before the mold is restored to its flat state for pattern formation.
Solution Approach 2:
The mold's shape is dynamically changed during the process - temporarily deflected convex toward the substrate to expel air bubbles, then restored to flat for imprinting. This dynamic shape control allows the mold to adapt to different operational requirements and eliminate harmful air bubbles.
2Productivity
If the mold is peeled off from the cured resin at the same time upon mold releasing, then the release is efficient, but a large peel-off stress is instantaneously applied causing pattern distortion
Solution Approach 1:
The mold is temporarily deflected toward the substrate before release, which gradually peels the mold off from the periphery of the cured resin pattern. This preliminary deformation distributes the peel-off stress over time and space, preventing instantaneous stress concentration that would cause pattern distortion.
Solution Approach 2:
The mold release is performed in a periodic manner through temporary deflection - the mold is first deflected convex to initiate gradual peeling from the periphery, then restored to flat to complete the release. This periodic action avoids sudden stress application while maintaining release efficiency.
3Force
If the mold is deformed and released from the periphery of the resin pattern, then the peel-off stress is reduced, but the resin pattern is inclined by being pushed by the concave and convex pattern causing stress on the root portion
Solution Approach 1:
The mold's shape is dynamically controlled - temporarily deflected convex toward the substrate during release to reduce peel-off stress, then precisely restored to its original flat state to prevent resin pattern inclination. This dynamic control ensures both stress reduction and pattern accuracy.
Solution Approach 2:
The system monitors the mold's deformation state and restores it to the original shape after temporary deflection. This feedback control ensures that the mold returns to its precise original configuration, preventing any inclination or stress on the resin pattern root portion while still achieving reduced peel-off stress during release.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces air bubble entrapment and peel-off stress, ensuring accurate pattern formation and minimizing resin pattern distortion, while maintaining the mold's deformation state for precise imprinting.
Implementation Method 1
a holder configured to attract the mold to hold the mold
Implementation Method 2
a pressure reduction device configured to reduce a back pressure of the mold held by the holder
Data Source
AI summary
The imprint apparatus of the present invention molds an imprint material on a substrate using a mold and cures the imprint material to form a pattern on the substrate. The apparatus includes a holder configured to attract the mold to hold the mold; and a pressure reduction device configured to reduce a back pressure of the mold held by the holder, wherein the apparatus is configured to reduce the back pressure by the pressure reduction device in parallel with release of the mold from the imprint material.