Imprint Mold Deformation for Alignment Detection
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Solution Overview
Problem
In the imprint technique for semiconductor devices, alignment errors occur due to physical contact between the mold and substrate, leading to overlay errors and reduced throughput, as existing detection systems are hindered by the presence of irradiation systems and alignment marks, making precise die-by-die alignment challenging.
Innovation Solution
An imprint apparatus with a deforming mechanism that protrudes the mold's central portion with a mark for early detection, combined with a detecting unit using a photoelectric conversion device, relay optical system, and illuminating and imaging system to form intermediate images of alignment marks, allowing for precise alignment before full pattern contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the TTM detecting system is positioned to avoid interference with the irradiation system, then the detection system can operate without obstruction, but the detection timing is delayed until the peripheral portion contacts the resin
Solution Approach 1:
The mold is divided into two functional regions: a peripheral portion for early alignment detection and a central pattern region for final imprinting. This segmentation allows the detection system to access alignment marks on the peripheral portion before the central pattern region contacts the resin, resolving the timing conflict between detection and irradiation systems
Solution Approach 2:
Alignment detection is performed preliminarily on the peripheral portion of the mold before the central pattern region makes contact with the resin. This preliminary alignment action enables position correction to be completed in advance, ensuring accurate overlay when the full pattern is imprinted later
2Productivity
If the mold is deformed to bring the central portion into contact first, then the filling time is reduced and release force is reduced, but alignment marks in the peripheral portion cannot be detected early
Solution Approach 1:
The mold is segmented into a peripheral portion containing alignment marks and a central portion containing the pattern region. The peripheral portion is designed to contact the resin first for alignment detection, while the central portion follows for pattern transfer, enabling both early alignment and efficient filling
Solution Approach 2:
Alignment detection is performed preliminarily on the peripheral portion before the central pattern region contacts the resin. This allows the alignment operation to be completed in advance, preventing delays in the overall imprinting process while maintaining high productivity
3Manufacturing precision
If the mold and substrate are brought into physical contact, then pattern transfer is achieved, but substrate displacement occurs causing overlay errors
Solution Approach 1:
Alignment detection and correction are performed preliminarily on the peripheral portion of the mold before the central pattern region makes contact with the substrate. This preliminary alignment action ensures the substrate is properly positioned and secured, preventing displacement during the subsequent pattern transfer process
Solution Approach 2:
The peripheral portion of the mold acts as an intermediary element that contacts the resin first to perform alignment detection and correction. This intermediary action establishes accurate positioning before the main pattern transfer occurs, ensuring both precision and stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables earlier and more accurate detection of relative positions, reducing alignment force requirements and preventing substrate displacement, thereby increasing throughput and reducing overlay errors.
Implementation Method 1
the detecting unit includes a photoelectric conversion device, a relay optical system, and an illuminating and imaging system placed between the photoelectric conversion device and the relay optical system
Implementation Method 2
the illuminating and imaging system illuminates the substrate through the relay optical system so as to form, on the photoelectric conversion device, images of intermediate images of the first mark and the second mark
Data Source
AI summary
An apparatus for bringing a mold having a pattern region and a first mark into contact with an imprint material on a substrate having a second mark, includes a deforming mechanism configured to deform the mold such that a portion of the mold where the first mark is formed protrudes toward the substrate, a driving mechanism configured to adjust a distance between the mold and the substrate, and a detecting unit configured to detect, after the driving mechanism starts an operation of reducing the distance, the first mark and the second mark in a state in which the portion of the mold and the imprint material on the substrate are in contact with each other but a whole of the pattern region is not in contact with the imprint material.