Layered Imprint Mold Etching Stopper Recess Depth Control

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Solution Overview

Problem

Existing imprint molds struggle to achieve high accuracy in forming three-dimensional transfer patterns with recesses of less than 1 μm in width or depth, which is crucial for producing optical elements with high precision.

Innovation Solution

A method for manufacturing an imprint mold involving a stack of mold base material layers and an etching stopper layer, where the mold base material layers and etching stopper layers have etching selectivity for each other, allowing for precise formation of recesses with different depths through controlled etching processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional imprint mold method is used to form fine patterns, then the manufacturing process is simple, but the formation accuracy of three-dimensional transfer patterns with recesses less than 1 μm is insufficient

Engineering Contradiction:
Improveformation accuracy of transfer patternVSAvoidmold structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mold structure is segmented into multiple mold base material layers with different thicknesses, where each layer contributes to forming recesses at specific depth ranges. This segmentation enables precise control of three-dimensional transfer patterns by selectively etching through specific layer combinations, resolving the contradiction between high formation accuracy and structural simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from controlling only recess depth to controlling both recess depth and lateral dimensions through the layered structure. By varying the thickness of mold base material layers and utilizing etching selectivity, the method achieves precise three-dimensional pattern formation, addressing the accuracy requirement while maintaining manageable complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the mold pattern is transferred at the same magnification as the final product, then the pattern accuracy is directly reflected in the optical element accuracy, but it becomes extremely difficult to form the transfer pattern with the required high accuracy

Engineering Contradiction:
Improvetransfer pattern accuracyVSAvoiddifficulty of forming transfer pattern
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

By dividing the mold into multiple base material layers with different thicknesses, the invention simplifies the formation of accurate three-dimensional patterns. Each layer can be etched independently to create recesses at predetermined depths, making it easier to achieve high transfer pattern accuracy without requiring extremely difficult single-step etching processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mold structure is prepared in advance with multiple layers of specific thicknesses designed to correspond to the desired recess depth ranges. This preliminary structuring enables direct transfer of accurate patterns during the etching process, eliminating the need for complex post-processing or iterative adjustments to achieve the required precision.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If multiple recesses with different depths are formed in the mold, then the three-dimensional pattern accuracy is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvedepth accuracy of recessesVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into systematic etching steps corresponding to different mold base material layers. Each etching step targets a specific depth range by removing predetermined combinations of layers, transforming a complex multi-depth formation process into a series of manageable, repeatable operations with clear depth control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the physical parameter of layer thickness to encode depth information. By designing mold base material layers with specific thicknesses that correspond to target recess depths, the manufacturing process achieves high depth accuracy through controlled material removal rather than complex positioning and measurement, simplifying the overall process.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves high formation accuracy of three-dimensional shape transfer patterns with multiple recesses, significantly improving the precision of optical elements by ensuring accurate depth and position control of the recesses.

Implementation Method 1

the mold base material layer and the etching stopper layer are made of materials having etching selectivity for each other

Methodology Applied
Scientific EffectEtching selectivity:

Data Source

PatentUS12304114B2Method for manufacturing imprint mold, imprint mold, mold blank, and method for manufacturing optical element
Publication Date: 2025.05.20 HOYA CORPORATION
  • US12304114B2 patent drawing
  • US12304114B2 patent drawing
  • US12304114B2 patent drawing

AI summary

Provided are an imprint mold having a plurality of recesses constituting a predetermined mold pattern, in which the imprint mold comprises a stack, comprising a plurality of mold base material layers and an etching stopper layer interposed between the mold base material layers, on a substrate, the stack has the plurality of recesses having different depths, the mold base material layer and the etching stopper layer are made of materials having etching selectivity for each other, and each of the plurality of recesses has a bottom surface on which the etching stopper layer is exposed, and technology related thereto.