Imprint Mold Foreign Particle Removal via Dummy Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In imprint technology, foreign particles adhering to the mold can prevent accurate pattern formation on substrates, especially when actual device wafers are processed after dummy wafers are removed, leading to potential inaccuracies in the first shot region.
Innovation Solution
An imprint method that includes carrying a substrate into an imprint apparatus, removing foreign particles from the mold by contacting it with a dedicated dummy plate or member within the apparatus, and then curing the imprint material to form patterns on the substrate using the cleaned mold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If foreign particles are removed from the mold before carrying the substrate into the imprint apparatus, then manufacturing precision is improved, but device complexity increases due to additional cleaning steps and equipment
Solution Approach 1:
The patent applies preliminary action by performing foreign particle removal immediately after substrate loading, before the actual imprint process begins. The dummy plate is brought into contact with the mold to remove particles that may have adhered during substrate handling, ensuring the mold is clean before pattern formation. This timing ensures particle removal happens proactively rather than reactively.
Solution Approach 2:
The patent introduces a dummy plate as an intermediary element to facilitate foreign particle removal. The dummy plate serves as a mediator between the cleaning mechanism and the mold, allowing particles to be removed through contact during the dummy plate imprinting process. This intermediary approach simplifies the overall system by using an existing component (dummy plate) for dual purposes.
2Manufacturing precision
If foreign particles are removed by using a dummy wafer before substrate processing, then manufacturing precision is improved, but productivity decreases due to additional process steps
Solution Approach 1:
The patent merges the foreign particle removal function with the existing dummy plate imprinting process. Instead of adding a separate cleaning step, the dummy plate imprinting serves dual purposes: removing foreign particles from the mold and preparing for subsequent substrate processing. This consolidation eliminates redundant steps and maintains productivity while ensuring pattern formation accuracy.
Solution Approach 2:
The dummy plate is given multi-functionality by using it both for foreign particle removal and as part of the normal imprinting sequence. The same dummy plate that would otherwise be used for calibration or test purposes now also serves to clean the mold surface, maximizing the utility of existing components and avoiding additional equipment or process steps.
3Manufacturing precision
If foreign particles are removed after substrate loading but before imprinting, then manufacturing precision is improved, but loss of time occurs during the additional cleaning step
Solution Approach 1:
The patent maintains continuity of useful action by integrating foreign particle removal into the continuous flow of the imprinting process. The dummy plate imprinting that removes particles is performed seamlessly after substrate loading without interrupting the overall process flow. This ensures that the mold is cleaned of particles while maintaining continuous productive action, avoiding idle time or process interruptions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate pattern formation on substrates by effectively removing foreign particles from the mold before processing actual device wafers, preventing inaccuracies and improving productivity by integrating foreign particle removal directly within the imprint process.
Implementation Method 1
bringing a mold and an imprint material on a substrate into contact with each other
Implementation Method 2
curing the imprint material while maintaining the contact
Data Source
AI summary
An imprint method for forming a pattern on a substrate by using a mold includes carrying the substrate into an imprint apparatus, removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern formed on the mold by bringing into contact the mold and an imprint material supplied to a member different from the substrate within the imprint apparatus, and curing the imprint material so as to form the pattern, and forming the pattern on the substrate that has carried into the imprint apparatus, by using the mold from which the foreign particles are removed.