Imprint Mold Peeling Boundary Control for Central Defect Reduction
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Solution Overview
Problem
Existing imprint techniques face challenges in suppressing pattern defects, particularly in the central portion of the molding region, due to high peeling speeds and stress issues during mold-releasing, which can affect device performance in semiconductor manufacturing and other applications.
Innovation Solution
An imprint method where the mold is released from the imprint material with two opposed boundaries maintaining a linear state, controlling the peeling process to prevent excessive stress and defect formation by deforming the mold and substrate using fluid pressure, mechanical forces, or electrical fields to ensure symmetrical peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If peeling progresses isotropically from the peripheral portion towards the central portion, then the mold-releasing process is simple, but the speed of progress of peeling increases resulting in high defect density in the central portion
Solution Approach 1:
The patent applies asymmetry by changing the peeling progression from isotropic (circular) to anisotropic (linear along two opposed boundaries). The mold is designed with specific boundary conditions that cause peeling to occur preferentially along linear paths rather than radiating uniformly from the periphery, thereby controlling the peeling speed and reducing central defect density
Solution Approach 2:
The patent employs dynamics by controlling the peeling speed through dynamic adjustment of the separation speed between mold holder and substrate holder. By setting the separation speed to zero at the start of mold-releasing and managing the peeling progression dynamically, the system maintains controlled stress levels throughout the process
2Reliability
If the separation speed between mold holder and substrate holder is set to zero at the start of mold-releasing, then initial stress is reduced, but peeling may not progress completely depending on mold-releasing force and mold structure
Solution Approach 1:
The patent applies preliminary action by pre-setting the separation speed to zero at the start of mold-releasing. This preliminary condition ensures that the peeling process begins under controlled stress conditions, preventing immediate high-speed peeling that would cause defects. The system then allows peeling to progress naturally as the mold-releasing force overcomes the adhesion forces
Solution Approach 2:
The patent implements feedback by monitoring the peeling progression and adjusting the mold-releasing force accordingly. The system observes whether peeling is progressing completely and uses this information to adjust the separation speed and force application to ensure complete peeling while maintaining defect suppression
3Productivity
If mold-releasing force is increased to ensure complete peeling, then peeling completion is improved, but stress on the resin pattern and mold increases causing defects
Solution Approach 1:
The patent applies dynamics by using dynamic control of the separation speed between mold holder and substrate holder. Rather than applying a static high force, the system dynamically adjusts the separation speed to match the peeling progression, ensuring complete peeling while maintaining stress levels below the defect threshold throughout the process
Data Source
AI summary
Provided is an imprint method that molds an uncured resin applied to a substrate by a pattern portion formed on a mold and cures the uncured resin so as to form the pattern of the resin cured on the substrate. The imprint method includes a step of releasing the pattern portion from the resin such that two opposed boundaries are brought closer to each other to progress peeling while maintaining a parallel state after curing of the resin based on the assumption that the boundary at which the pattern portion is peeled from the resin is linear.