Imprint Mold Magnification Correction via Side Force Application
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Solution Overview
Problem
In imprint techniques for manufacturing semiconductor devices, achieving high accuracy in overlaying patterns on molds onto substrates is hindered by distortion caused by uneven forces applied to the mold's side surfaces, leading to insufficient magnification correction and accuracy issues.
Innovation Solution
An imprint apparatus with a changing unit that applies forces to the mold's side surfaces using a contact member, and an adjusting unit that adjusts the angle and position of the contact member to optimize the contact state, thereby minimizing distortion and improving magnification correction accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple holding units independently drive different portions of the mold in the Z-direction to correct the mold shape, then overlay accuracy is improved, but the mold develops complicated distortion and magnification correction becomes insufficient
Solution Approach 1:
The patent changes the driving direction of the holding units from the Z-direction (perpendicular to substrate) to the X-direction (parallel to substrate surface). This parameter change in driving direction allows the holding units to apply corrective forces that adjust mold magnification without causing the complicated distortion that occurs when driving in the Z-direction. The contact members press against the side surface of the mold to apply forces in the X-direction, enabling magnification correction while maintaining proper mold shape.
2Manufacturing precision
If multiple portions on the side surface of the mold are pressed in the same manner to perform magnification correction, then magnification correction is achieved, but forces act in directions different from the pressing direction causing pattern distortion
Solution Approach 1:
The patent applies local quality by providing multiple contact members at different positions on the side surface of the mold, where each contact member can be independently adjusted. The adjusting units allow each contact member to have its angle and position optimized locally to match the specific geometry of the mold side surface at that location. This ensures that forces are applied in the correct X-direction at each local position, preventing pattern distortion while achieving accurate magnification correction.
Solution Approach 2:
The patent introduces dynamics by making the angle and position of each contact member adjustable through adjusting units. This allows the system to dynamically adapt the contact configuration to the specific mold geometry and required correction amounts. The contact members can be independently positioned and angled to apply forces in the correct directions, enabling flexible magnification correction without causing distortion.
3Manufacturing precision
If the number of portions where forces are applied to the mold is increased to achieve high accuracy magnification correction, then overlay accuracy improves, but the mechanism complexity increases
Solution Approach 1:
The patent applies universality by designing the holding units to perform multiple functions: they provide both support for the mold and apply corrective forces for magnification correction. The same holding units that hold the mold in place also include contact members and adjusting units that enable precise magnification correction. This multi-functionality reduces the need for separate correction mechanisms, thereby reducing overall system complexity while achieving high accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise transfer of patterns from molds to substrates by reducing stress concentration and distortion, enhancing overlay accuracy and simplifying the magnification correction process.
Implementation Method 1
a contact member 26 having a contact surface 26c that comes into contact with a side surface of the mold 1, and is configured to apply a force to the side surface of the mold 1 through the contact member 26 to change a shape of the pattern 1a formed on the mold 1
Implementation Method 2
an adjusting unit 30 configured to change at least one of an angle and a position of the contact member 26 to adjust a contact state between the contact surface 26c and the side surface of the mold 1
Data Source
AI summary
The present invention provides an imprint apparatus which performs an imprint process in which a resin on a substrate is cured while a mold having a pattern formed thereon is pressed against the resin to transfer the pattern onto the substrate, the apparatus comprising a changing unit which includes a contact member having a contact surface that comes into contact with a side surface of the mold, and is configured to apply a force to the side surface of the mold through the contact member to change a shape of the pattern formed on the mold, and an adjusting unit configured to change at least one of an angle and a position of the contact member to adjust a contact state between the contact surface and the side surface of the mold.