Imprint Mold Surface Treatment for Residual Film Removal

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Solution Overview

Problem

The imprint lithography method for forming patterns in display devices often results in residual films due to the undesirable interaction between the mold and the light shielding material, leading to poor reproducibility and additional processing requirements for removing these residues.

Innovation Solution

The method involves surface treatment of the substrate to adjust the interface tensions between the substrate and the light shielding material, using CF4 plasma treatment or O2/CF4 plasma and self-assembly monolayer treatments, to facilitate the removal of residual films by forming a mold with a light shielding film that can effectively separate from the master layer and insulation substrate, ensuring precise pattern formation and minimizing residual film formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If imprint lithography method is used to form patterns, then manufacturing cost is reduced and process is simplified, but residual films remain on the substrate due to undesirable interaction between mold and light shielding material

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidresidual film formation
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The invention changes the surface energy parameters of the master layer by applying surface treatments (plasma treatment, self-assembly monolayer treatment) to modify its chemical composition and physical properties. This parameter change creates a surface with lower surface energy that prevents adhesion of light shielding material, thereby eliminating residual film formation while maintaining the simplicity of imprint lithography

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention introduces an intermediary substance (surface treatment layer such as plasma-treated layer or self-assembly monolayer) between the master layer and the light shielding material. This intermediary layer acts as a release agent that prevents direct adhesion between the mold and the material being molded, allowing clean separation without residual films

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If light shielding material is sprayed onto color filter pattern, then openings are covered effectively, but light shielding material adheres to solid portions of color filter creating residual films

Engineering Contradiction:
Improvepattern formation accuracyVSAvoidresidual film on color filter
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The invention applies different surface properties to different regions: the master layer regions corresponding to openings are treated to have low adhesion to light shielding material, while other regions maintain normal properties. This local differentiation allows light shielding material to be deposited precisely in opening regions without adhering to solid portions of the color filter

Inventive Principle:
Principle #3Local quality

3Device complexity

If mold is formed without surface treatment, then manufacturing process is simpler, but mold separation from master layer is difficult and residual films remain

Engineering Contradiction:
Improveprocess stepsVSAvoidmold separation quality
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The invention performs preliminary surface treatment on the master layer before forming the mold. This preliminary action modifies the surface properties in advance to prevent adhesion, ensuring that when the mold is later separated from the master layer, it can be easily removed without residual films, thereby improving reliability without significantly increasing complexity

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the effective removal of residual films during the molding process, improving pattern reproducibility and reducing the need for additional processing steps, thereby enhancing the manufacturing efficiency and quality of display devices.

Implementation Method 1

the surface treatment includes a CF4 plasma treatment

Methodology Applied
Scientific EffectPlasma treatment: Plasma

Implementation Method 2

increasing the difference in interface tensions between the master layer and the light shielding material through the surface treatment

Methodology Applied
Scientific EffectInterface tension reduction: Surface Tension

Implementation Method 3

jetting a light shielding material inside the opening after treating a surface of the base substrate exposed through the opening of the master layer and increasing the difference in interface tensions

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS8043550B2Manufacturing method of display device and mold therefor
Publication Date: 2011.10.25 SAMSUNG DISPLAY CO LTD
  • US8043550B2 patent drawing
  • US8043550B2 patent drawing
  • US8043550B2 patent drawing

AI summary

A method of manufacturing a display device in which a film deposited on a substrate through openings in a covering layer is easily removed from the covering layer, is described herein, includes forming a master layer having a predetermined pattern of openings on a base substrate; spraying a light shielding material on the master layer; fabricating a mold provided with the light shielding film by forming a moldable material layer on the base substrate and the master layer; the moldable material layer and the light shielding material; arranging, pressurizing, and exposing the mold on an insulation substrate having a photosensitive film formed thereon after separating the mold from the master layer; and developing the photosensitive film after separating the mold from the insulation substrate.